Inventor · disambiguated record
Li-Hsien Huang
Also filed as: HUANG LI · HUANG LI-HSIEN
109 granted patents·30 pending applications·1,030 citations·filing 2011–2025
99Inventor score
Top patents by PatentIndex Score
139 records- 0199US11444021B2Device and package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 13, 2022·5 cites·20 claims
- 0299US9859245B1Chip package structure with bump and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 2, 2018·48 cites·20 claims
- 0398US10347606B2Devices employing thermal and mechanical enhanced layers and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 9, 2019·19 cites·20 claims
- 0498US10163803B1Integrated fan-out packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·42 cites·20 claims
- 0598US9922964B1Package structure with dummy dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 20, 2018·23 cites·20 claims
- 0698US9825007B1Chip package structure with molding layer and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 21, 2017·21 cites·17 claims
- 0798US8809996B2Package with passive devices and method of forming the sameCHEN SHUO-MAO·Filed 2012·Granted Aug 19, 2014·578 cites·19 claims
- 0897US12170207B2Stacked semiconductor devices and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 17, 2024·2 cites·20 claims
- 0997US10811394B2Devices employing thermal and mechanical enhanced layers and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 20, 2020·10 cites·20 claims
- 1097US10147692B2Package with UBM and methods of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 4, 2018·18 cites·19 claims
- 1197US10083927B2Chip package structure with bumpTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Sep 25, 2018·12 cites·20 claims
- 1297US9793246B1Pop devices and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 17, 2017·30 cites·20 claims
- 1396US12062602B2Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 13, 2024·3 cites·20 claims
- 1496US10879224B2Package structure, die and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 29, 2020·15 cites·20 claims
- 1596US9666522B2Alignment mark design for packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted May 30, 2017·20 cites·20 claims
- 1695US11587900B2Package structure including IPD and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 21, 2023·3 cites·20 claims
- 1795US10854565B2Chip package structure with bumpTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 1, 2020·7 cites·20 claims
- 1895US9984998B2Devices employing thermal and mechanical enhanced layers and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 29, 2018·9 cites·20 claims
- 1995US9911672B1Semiconductor devices, method for fabricating integrated fan-out packages, and method for fabricating semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 6, 2018·22 cites·17 claims
- 2095US9831215B1Semiconductor package and forming method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 28, 2017·13 cites·20 claims
- 2195US9806059B1Multi-stack package-on-package structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 31, 2017·11 cites·20 claims
- 2294US12327819B2Devices employing thermal and mechanical enhanced layers and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 10, 2025·1 cites·20 claims
- 2394US11854994B2Redistribution structure for integrated circuit package and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·2 cites·20 claims
- 2493US11177142B2Method for dicing integrated fan-out packages without seal ringsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 16, 2021·10 cites·20 claims
- 2593US10636775B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 28, 2020·6 cites·20 claims
- 2693US10163661B2Stacked semiconductor devices and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 25, 2018·7 cites·20 claims
- 2793US10090241B2Device, package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 2, 2018·6 cites·20 claims
- 2892US12159853B2Package structure including IPD and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 3, 2024·1 cites·20 claims
- 2992US11502032B2Chip package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 15, 2022·2 cites·20 claims
- 3092US10734357B2Chip package structure with molding layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 4, 2020·6 cites·20 claims
- 3191US10672741B2Semiconductor packages with thermal-electrical-mechanical chips and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jun 2, 2020·7 cites·17 claims
- 3291US10163701B2Multi-stack package-on-package structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·6 cites·20 claims
- 3390US10276549B2Package structure with dummy dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 30, 2019·4 cites·20 claims
- 3490US8487410B2Through-silicon vias for semicondcutor substrate and method of manufactureYU CHEN-HUA·Filed 2011·Granted Jul 16, 2013·8 cites·9 claims
- 3589US11075150B2Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 27, 2021·4 cites·18 claims
- 3689US10720409B2Semiconductor packages with thermal-electrical-mechanical chips and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 21, 2020·5 cites·20 claims
- 3788US12469781B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Nov 11, 2025·0 cites·20 claims
- 3888US2025364441A1Semiconductor device package and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3988US2024387431A1Chip Package Structure with BumpTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4088US2025273631A1Devices employing thermal and mechanical enhanced layers and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4188US2025372540A1Semiconductor device package and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4287US12431417B2Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Sep 30, 2025·0 cites·20 claims
- 4387US2025323133A1Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4487US2025357146A1Redistribution lines having stacking viasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4586US11410956B2Chip package structure with bumpTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 9, 2022·1 cites·20 claims
- 4686US11062978B2Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 13, 2021·3 cites·20 claims
- 4786US10741490B2Device and package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 11, 2020·2 cites·20 claims
- 4886US2024371840A1Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4985US12087745B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 10, 2024·0 cites·20 claims
- 5085US10529650B2Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 7, 2020·3 cites·20 claims
Showing the top 50 of 139 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →