Inventor · disambiguated record
Liu Huang
Also filed as: HUANG LIU
13 granted patents·2 pending applications·149 citations·filing 2001–2019
91Inventor score
Files withCHARTERED SEMICONDUCTOR MFG7GLOBALFOUNDRIES SG PTE LTD2UNIV DALIAN TECH2CHARTERED SEMICONDUCTORS MFG L1HONG YU1
Top patents by PatentIndex Score
15 records- 0189US6787452B2Use of amorphous carbon as a removable ARC material for dual damascene fabricationCHARTERED SEMICONDUCTOR MFG·Filed 2002·Granted Sep 7, 2004·51 cites·31 claims
- 0284US9269651B2Hybrid TSV and method for forming the sameGLOBALFOUNDRIES SG PTE LTD·Filed 2015·Granted Feb 23, 2016·7 cites·20 claims
- 0381US8916472B2Interconnect formation using a sidewall mask layerHU XIANG·Filed 2012·Granted Dec 23, 2014·6 cites·18 claims
- 0481US7538353B2Composite barrier/etch stop layer comprising oxygen doped SiC and SiC for interconnect structuresCHARTERED SEMICONDUCTOR MFG·Filed 2006·Granted May 26, 2009·11 cites·14 claims
- 0579US7052932B2Oxygen doped SiC for Cu barrier and etch stop layer in dual damascene fabricationCHARTERED SEMICONDUCTOR MFG·Filed 2004·Granted May 30, 2006·28 cites·24 claims
- 0676US8354327B2Scheme for planarizing through-silicon viasGLOBALFOUNDRIES SG PTE LTD·Filed 2011·Granted Jan 15, 2013·8 cites·24 claims
- 0770US9006102B2Hybrid TSV and method for forming the sameHONG YU·Filed 2011·Granted Apr 14, 2015·5 cites·25 claims
- 0862US6872633B2Deposition and sputter etch approach to extend the gap fill capability of HDP CVD process to ≦0.10 micronsCHARTERED SEMICONDUCTOR MFG·Filed 2002·Granted Mar 29, 2005·11 cites·29 claims
- 0960US7208426B2Preventing plasma induced damage resulting from high density plasma depositionCHARTERED SEMICONDUCTORS MFG L·Filed 2001·Granted Apr 24, 2007·12 cites·20 claims
- 1059US7186640B2Silicon-rich oxide for copper damascene interconnect incorporating low dielectric constant dielectricsCHARTERED SEMICONDUCTOR MFG·Filed 2002·Granted Mar 6, 2007·7 cites·36 claims
- 1153US11767455B2Superhydrophobic hemispherical array which can realize droplet pancake bouncing phenomenonUNIV DALIAN TECH·Filed 2019·Granted Sep 26, 2023·0 cites·1 claims
- 1251US11104043B2Thermal extrusion method to fabricate large-dimension superhydrophobic cylinder pillar arrays with droplet pancake bouncing phenomenonUNIV DALIAN TECH·Filed 2017·Granted Aug 31, 2021·0 cites·3 claims
- 1348US7148157B2Use of phoslon (PNO) for borderless contact fabrication, etch stop/barrier layer for dual damascene fabrication and method of forming phoslonCHARTERED SEMICONDUCTOR MFG·Filed 2002·Granted Dec 12, 2006·3 cites·29 claims
- 1436US2008124855A1Modulation of Stress in ESL SiN Film through UV Curing to Enhance both PMOS and NMOS Transistor PerformanceWIDODO JOHNNY·Filed 2006·Application pending·0 cites
- 1533US2004005781A1HDP SRO liner for beyond 0.18 um STI gap-fillCHARTERED SEMICONDUCTOR MFG·Filed 2002·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Liu Huang files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →