Inventor · disambiguated record
Li Huang
Also filed as: HUANG LI · HUANG LI-CHIH
6 granted patents·2 pending applications·8 citations·filing 2011–2024
70Inventor score
Top patents by PatentIndex Score
8 records- 0181US10586751B2Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Mar 10, 2020·5 cites·22 claims
- 0269US8591692B2Method for manufacturing rigid-flexible printed circuit boardWANG MING-DE·Filed 2011·Granted Nov 26, 2013·3 cites·6 claims
- 0365US12434315B2Reverse soldering connection structure of microneedle and wiring and preparation process thereforWUHAN NEURACOM TECH DEVELOPMENT CO LTD·Filed 2024·Granted Oct 7, 2025·0 cites·6 claims
- 0461US12311138B2Area array micro-needle structureWUHAN NEURACOM TECH DEVELOPMENT CO LTD·Filed 2024·Granted May 27, 2025·0 cites·7 claims
- 0560US12390163B2Composite microneedle structure based on integrated circuit chipWUHAN NEURACOM TECH DEVELOPMENT CO LTD·Filed 2024·Granted Aug 19, 2025·0 cites·7 claims
- 0658US2024398350A1Neural interface with auxiliary structureWUHAN NEURACOM TECH DEVELOPMENT CO LTD·Filed 2024·Application pending·0 cites
- 0756US12263001B2Neural interface circuit for bidirectional signal transmissionWUHAN NEURACOM TECH DEVELOPMENT CO LTD·Filed 2024·Granted Apr 1, 2025·0 cites·3 claims
- 0848US2024351859A1Connection line structure and forming method thereofWUHAN NEURACOM TECH DEVELOPMENT CO LTD·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →