Inventor · disambiguated record
Liang-Yi Hung
Also filed as: HUNG LIANG-YI
9 granted patents·19 pending applications·11 citations·filing 2003–2024
80Inventor score
Files withSILICONWARE PRECISION INDUSTRIES CO LTD22ACADEMIA SINICA2HUNG LIANG-YI2DCB USA LLC1HSIAO WEI-CHUNG1
Top patents by PatentIndex Score
28 records- 0172US6864238B1Methods and compositions for destabilizing microtubulesACADEMIA SINICA·Filed 2003·Granted Mar 8, 2005·5 cites·6 claims
- 0269US9607923B2Electronic device having a thermal conductor made of silver between a heat sink and an electronic element, and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Mar 28, 2017·3 cites·28 claims
- 0361US7449563B2Methods and compositions for destabilizing microtubulesACADEMIA SINICA·Filed 2004·Granted Nov 11, 2008·0 cites·8 claims
- 0461US2025132221A1Electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 0560US8796867B2Semiconductor package and fabrication method thereofHSIAO WEI CHUNG·Filed 2012·Granted Aug 5, 2014·1 cites·10 claims
- 0660US2025293113A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 0759US8471383B2Semiconductor package and fabrication method thereofHUNG LIANG-YI·Filed 2011·Granted Jun 25, 2013·2 cites·16 claims
- 0858US2025266314A1Manufacturing method of electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 0958US2025105068A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 1058US2025309040A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 1157US2025364339A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 1255US2025279347A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 1354US2024321672A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Application pending·0 cites
- 1453US9112063B2Fabrication method of semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Aug 18, 2015·0 cites·13 claims
- 1552US2025379174A1Electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 1651US2024363577A1Electronic package and substrate structure thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Application pending·0 cites
- 1749US2024096835A1Manufacturing method of electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2022·Application pending·0 cites
- 1848US2014057410A1Method of fabricating a packaging substrateSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2012·Application pending·0 cites
- 1946US10096491B2Method of fabricating a packaging substrate including a carrier having two carrying portionsSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Oct 9, 2018·0 cites·5 claims
- 2044US2008150128A1Heat dissipating chip structure and fabrication method thereof and package having the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2007·Application pending·0 cites
- 2144US2008164604A1Heat dissipating semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2008·Application pending·0 cites
- 2242US2015102484A1Package structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
- 2341US2015028485A1Substrate structure and semiconductor package having the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
- 2441US2015179598A1Flip-chip packaging structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Application pending·0 cites
- 2539US2013026657A1Semiconductor package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2011·Application pending·0 cites
- 2637US10174322B2Short interfering RNA for treating cancerDCB USA LLC·Filed 2016·Granted Jan 8, 2019·0 cites·6 claims
- 2735US9542598B2Package structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Jan 10, 2017·0 cites·21 claims
- 2834US2013228921A1Substrate structure and fabrication method thereofHUNG LIANG-YI·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →