Inventor · disambiguated record
Liwen Jin
Also filed as: JIN LIWEN
3 granted patents·5 pending applications·7 citations·filing 2011–2022
60Inventor score
Files withINTEL CORP3BEIJING DAJIA INTERNET INFORMATION TECH CO LTD1JIN LIWEN1LEE POH SENG1SENEVIRATNE DILAN1
Top patents by PatentIndex Score
8 records- 0175US9320149B2Bumpless build-up layer package including a release layerINTEL CORP·Filed 2012·Granted Apr 19, 2016·4 cites·14 claims
- 0266US9554468B2Panel with releasable coreINTEL CORP·Filed 2014·Granted Jan 24, 2017·2 cites·23 claims
- 0356US9451696B2Embedded architecture using resin coated copperSENEVIRATNE DILAN·Filed 2012·Granted Sep 20, 2016·1 cites·20 claims
- 0444US2022337577A1Method and device for application loginBEIJING DAJIA INTERNET INFORMATION TECH CO LTD·Filed 2022·Application pending·0 cites
- 0542US2016141265A1Bumpless build-up layer package including a release layerINTEL CORP·Filed 2016·Application pending·0 cites
- 0638US2013299145A1Heat sink systemUNIV SINGAPORE·Filed 2013·Application pending·0 cites
- 0737US2014326441A1Cluster of inclined structuresLEE POH SENG·Filed 2014·Application pending·0 cites
- 0834US2011287074A1Antimicrobial Compositions, Methods of Manufacture Thereof and Articles Comprising the SameJIN LIWEN·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →