Inventor · disambiguated record
Lisa H. Karlin
Also filed as: KARLIN LISA · KARLIN LISA H
13 granted patents·3 pending applications·62 citations·filing 2008–2014
89Inventor score
Top patents by PatentIndex Score
16 records- 0188US8138062B2Electrical coupling of wafer structuresLIU LIANJUN·Filed 2009·Granted Mar 20, 2012·16 cites·20 claims
- 0285US8039312B1Method for forming a capped micro-electro-mechanical system (MEMS) deviceFREESCALE SEMICONDUCTOR INC·Filed 2010·Granted Oct 18, 2011·16 cites·20 claims
- 0380US7846815B2Eutectic flow containment in a semiconductor fabrication processFREESCALE SEMICONDUCTOR INC·Filed 2009·Granted Dec 7, 2010·8 cites·11 claims
- 0476US8119431B2Method of forming a micro-electromechanical system (MEMS) having a gap stopPARK WOO TAE·Filed 2009·Granted Feb 21, 2012·8 cites·12 claims
- 0576US7943525B2Method of producing microelectromechanical device with isolated microstructuresFREESCALE SEMICONDUCTOR INC·Filed 2008·Granted May 17, 2011·6 cites·10 claims
- 0667US8921203B2Method of forming an integrated circuit having varying substrate depthKARLIN LISA H·Filed 2013·Granted Dec 30, 2014·2 cites·17 claims
- 0767US8525316B2Eutectic flow containment in a semiconductor fabrication processKARLIN LISA H·Filed 2010·Granted Sep 3, 2013·2 cites·16 claims
- 0866US8551814B2Method of fabricating a semiconductor device that limits damage to elements of the semiconductor device that are exposed during processingKARLIN LISA H·Filed 2010·Granted Oct 8, 2013·2 cites·13 claims
- 0965US8652865B2Attaching a MEMS to a bonding waferKARLIN LISA H·Filed 2011·Granted Feb 18, 2014·1 cites·5 claims
- 1056US8461656B2Device structures for in-plane and out-of-plane sensing micro-electro-mechanical systems (MEMS)PARK WOO TAE·Filed 2010·Granted Jun 11, 2013·1 cites·16 claims
- 1153US9233836B2Semiconductor device including accelerometer devicesKARLIN LISA H·Filed 2014·Granted Jan 12, 2016·0 cites·20 claims
- 1250US9061885B2Cavity based packaging for MEMS devicesKARLIN LISA H·Filed 2013·Granted Jun 23, 2015·0 cites·8 claims
- 1341US2010193884A1Method of Fabricating High Aspect Ratio Transducer Using Metal Compression BondingPARK WOO TAE·Filed 2009·Application pending·0 cites
- 1441US2014225206A1Pressure level adjustment in a cavity of a semiconductor dieLIN YIZHEN·Filed 2013·Application pending·0 cites
- 1535US8455286B2Method of making a micro-electro-mechanical-systems (MEMS) deviceKARLIN LISA H·Filed 2010·Granted Jun 4, 2013·0 cites·13 claims
- 1635US2012107992A1Method of producing layered wafer structure having anti-stiction bumpsKARLIN LISA H·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →