Inventor · disambiguated record
Lik Wai Kho
Also filed as: KHO LIK WAI
5 granted patents·1 pending application·0 citations·filing 2018–2023
63Inventor score
Top patents by PatentIndex Score
6 records- 0182US12421574B2High reliability lead-free solder alloy for electronic applications in extreme environmentsALPHA ASSEMBLY SOLUTIONS INC·Filed 2023·Granted Sep 23, 2025·0 cites·10 claims
- 0277US2023356333A1Cost-effective lead-free solder alloy for electronic applicationsALPHA ASSEMBLY SOLUTIONS INC·Filed 2023·Application pending·0 cites
- 0369US11724342B2Cost-effective lead-free solder alloy for electronic applicationsKESTER LLC·Filed 2021·Granted Aug 15, 2023·0 cites·4 claims
- 0466US11123823B2Cost-effective lead-free solder alloy for electronic applicationsKESTER LLC·Filed 2018·Granted Sep 21, 2021·0 cites·17 claims
- 0563US11732330B2High reliability lead-free solder alloy for electronic applications in extreme environmentsALPHA ASSEMBLY SOLUTIONS INC·Filed 2018·Granted Aug 22, 2023·0 cites·11 claims
- 0659US11577343B2Low-silver alternative to standard SAC alloys for high reliability applicationsALPHA ASSEMBLY SOLUTIONS INC·Filed 2018·Granted Feb 14, 2023·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →