Inventor · disambiguated record
Lingyu Kong
Also filed as: KONG LINGYU
9 granted patents·3 pending applications·5 citations·filing 2017–2025
78Inventor score
Top patents by PatentIndex Score
12 records- 0182US11177159B2Memory arrays and methods used in forming a memory array comprising strings of memory cellsMICRON TECHNOLOGY INC·Filed 2019·Granted Nov 16, 2021·4 cites·27 claims
- 0279US12451434B2Methods of forming microelectronic devices including differently sized conductive contact structuresMICRON TECHNOLOGY INC·Filed 2024·Granted Oct 21, 2025·0 cites·17 claims
- 0375US2025359057A1Electronic devices including a source seal adjacent to a source contactMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 0468US12376303B2Electronic devices including a source seal, and related methods and electronic systemsMICRON TECHNOLOGY INC·Filed 2022·Granted Jul 29, 2025·0 cites·20 claims
- 0567US12040274B2Microelectronic devices including differently sized conductive contact structures, and related memory devices, electronic systems, and methodsMICRON TECHNOLOGY INC·Filed 2021·Granted Jul 16, 2024·0 cites·15 claims
- 0666US10134599B2Self-anchored catalyst metal-assisted chemical etchingUNIV ILLINOIS·Filed 2017·Granted Nov 20, 2018·1 cites·20 claims
- 0760US11791202B2Memory arrays and methods used in forming a memory array comprising strings of memory cellsLODESTAR LICENSING GROUP LLC·Filed 2021·Granted Oct 17, 2023·0 cites·13 claims
- 0860US2024188299A1Three-dimensional memory array formation techniquesMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 0959US11758644B2Slotted vias for circuit boardsDELL PRODUCTS LP·Filed 2021·Granted Sep 12, 2023·0 cites·20 claims
- 1055US12207391B2Hatching ground under a pad in a printed circuit boardDELL PRODUCTS LP·Filed 2022·Granted Jan 21, 2025·0 cites·17 claims
- 1150US12408263B2Differential pair inner-side impedance compensationDELL PRODUCTS LP·Filed 2022·Granted Sep 2, 2025·0 cites·17 claims
- 1244US2022399363A1Integrated Circuitry Comprising A Memory Array Comprising Strings Of Memory Cells And Methods Including A Method Used In Forming A Memory Array Comprising Strings Of Memory CellsMICRON TECHNOLOGY INC·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →