Inventor · disambiguated record
Li-Guo Lee
Also filed as: LEE LI-GUO
8 granted patents·2 pending applications·18 citations·filing 2014–2018
81Inventor score
Technology areasH10W
Files withTAIWAN SEMICONDUCTOR MFG CO LTD10
Top patents by PatentIndex Score
10 records- 0182US10090267B2Bump structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Oct 2, 2018·5 cites·20 claims
- 0280US9735123B2Semiconductor device structure and manufacturing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 15, 2017·5 cites·20 claims
- 0379US10163843B2Semiconductor device structure and manufacturing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·2 cites·20 claims
- 0477US9997482B2Solder stud structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jun 12, 2018·4 cites·20 claims
- 0572US9806046B2Semiconductor device structure and manufacturing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Oct 31, 2017·2 cites·20 claims
- 0659US11217548B2Semiconductor device structure and manufacturing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 4, 2022·0 cites·20 claims
- 0754US11145613B2Method for forming bump structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 12, 2021·0 cites·20 claims
- 0853US2015262952A1Bump structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Application pending·0 cites
- 0952US2018033756A1Method for forming bump structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Application pending·0 cites
- 1045US9779969B2Package structure and manufacturing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Oct 3, 2017·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →