Inventor · disambiguated record
Ling Li
Also filed as: LI LING · LI LING-WEI
51 granted patents·24 pending applications·84 citations·filing 2007–2025
97Inventor score
Files withMAGIC LEAP INC22TAIWAN SEMICONDUCTOR MFG CO LTD15INST OF MICROELECTRONICS CAS10INST OF MICROELECTRONICS OF THE CHINESE ACADEMY OF SCIENCES8BOE TECHNOLOGY GROUP CO LTD5
Top patents by PatentIndex Score
75 records- 0197US11948876B2Package structure with through viasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 2, 2024·2 cites·20 claims
- 0296US11456276B2Chip package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 27, 2022·3 cites·20 claims
- 0393US11726317B2Waveguides having integral spacers and related systems and methodsMAGIC LEAP INC·Filed 2020·Granted Aug 15, 2023·5 cites·48 claims
- 0491US8232743B2Voltage converter and driving method for use in a backlight moduleCHEN KE-HORNG·Filed 2010·Granted Jul 31, 2012·21 cites·14 claims
- 0590US11784091B2Structure and formation method of chip package with fan-out featureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 10, 2023·2 cites·20 claims
- 0689US8148911B2Current-balance circuit and backlight module having the sameCHEN KE-HORNG·Filed 2009·Granted Apr 3, 2012·22 cites·15 claims
- 0788US11994670B2Color-selective waveguides for augmented reality/mixed reality applicationsMAGIC LEAP INC·Filed 2022·Granted May 28, 2024·1 cites·19 claims
- 0884US12255173B2Chip package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 18, 2025·0 cites·20 claims
- 0984US12183709B2Chip package structure with ring-like structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 31, 2024·0 cites·20 claims
- 1084US2025323096A1Package structure with fan-out featureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1183US12455457B2Eyepiece for head-mounted display and method for making the sameMAGIC LEAP INC·Filed 2024·Granted Oct 28, 2025·0 cites·20 claims
- 1283US2025085468A1Customized polymer/glass diffractive waveguide stacks for augmented reality/mixed reality applicationsMAGIC LEAP INC·Filed 2024·Application pending·0 cites
- 1382US12489045B2Package structure with through viasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Dec 2, 2025·0 cites·20 claims
- 1482US11088108B2Chip package structure including ring-like structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 10, 2021·2 cites·20 claims
- 1581US11656480B2Methods and systems for augmented reality display with dynamic field of viewMAGIC LEAP INC·Filed 2020·Granted May 23, 2023·1 cites·16 claims
- 1679US12072502B2Eyepiece for head-mounted display and method for making the sameMAGIC LEAP INC·Filed 2023·Granted Aug 27, 2024·0 cites·17 claims
- 1779US11855039B2Chip package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·0 cites·20 claims
- 1879US11848302B2Chip package structure with ring-like structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 19, 2023·0 cites·20 claims
- 1979US2024302652A1Color-selective waveguides for augmented reality/mixed reality applicationsMAGIC LEAP INC·Filed 2024·Application pending·0 cites
- 2078US12381114B2Package structure with fan-out featureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 5, 2025·0 cites·20 claims
- 2178US12235474B2Methods and systems for augmented reality display with dynamic field of viewMAGIC LEAP INC·Filed 2023·Granted Feb 25, 2025·0 cites·10 claims
- 2278US12189165B2Customized polymer/glass diffractive waveguide stacks for augmented reality/mixed reality applicationsMAGIC LEAP INC·Filed 2023·Granted Jan 7, 2025·0 cites·14 claims
- 2378US8378993B2Capacitive touch display panelCHUNGHWA PICTURE TUBES LTD·Filed 2010·Granted Feb 19, 2013·5 cites·13 claims
- 2477US11211318B2Bump layout for coplanarity improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 28, 2021·3 cites·19 claims
- 2577US8325123B2Liquid crystal display device with adaptive charging/discharging time and related driving methodLI LING·Filed 2010·Granted Dec 4, 2012·3 cites·3 claims
- 2676US10747349B2Display substrate, display panel, display apparatus and method for driving the sameBOE TECHNOLOGY GROUP CO LTD·Filed 2018·Granted Aug 18, 2020·2 cites·11 claims
- 2775US2024173930A1Method of fabricating molds for forming eyepieces with integrated spacersMAGIC LEAP INC·Filed 2023·Application pending·0 cites
- 2875US2024159956A1Waveguides having integrated spacers, waveguides having edge absorbers, and methods for making the sameMAGIC LEAP INC·Filed 2023·Application pending·0 cites
- 2973US11886000B2Waveguides having integrated spacers, waveguides having edge absorbers, and methods for making the sameMAGIC LEAP INC·Filed 2019·Granted Jan 30, 2024·1 cites·19 claims
- 3073US11545463B2Chip package structure with ring-like structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 3, 2023·0 cites·20 claims
- 3173US8120288B2Light emitting diode (LED) driving circuitLIU CHIA-LIN·Filed 2009·Granted Feb 21, 2012·9 cites·8 claims
- 3273US2024329282A1Polymer patterned disk stack manufacturingMAGIC LEAP INC·Filed 2024·Application pending·0 cites
- 3373US2025164818A1Methods and systems for augmented reality display with dynamic field of viewMAGIC LEAP INC·Filed 2025·Application pending·0 cites
- 3472US11630256B2Customized polymer/glass diffractive waveguide stacks for augmented reality/mixed reality applicationsMAGIC LEAP INC·Filed 2021·Granted Apr 18, 2023·0 cites·12 claims
- 3570US11740469B2Eyepiece for head-mounted display and method for making the sameMAGIC LEAP INC·Filed 2021·Granted Aug 29, 2023·0 cites·20 claims
- 3670US10964726B2Array substrate, display panel and display deviceBEIJING BOE OPTOELECTRONICS TECH CO LTD·Filed 2019·Granted Mar 30, 2021·1 cites·20 claims
- 3769US11307408B2Color-selective waveguides for augmented reality/mixed reality applicationsMAGIC LEAP INC·Filed 2020·Granted Apr 19, 2022·0 cites·36 claims
- 3868US11569159B2Structure and formation method of chip package with through viasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 31, 2023·0 cites·20 claims
- 3968US11099313B2Customized polymer/glass diffractive waveguide stacks for augmented reality/mixed reality applicationsMAGIC LEAP INC·Filed 2020·Granted Aug 24, 2021·0 cites·10 claims
- 4067US11840034B2Method of fabricating molds for forming eyepieces with integrated spacersMAGIC LEAP INC·Filed 2021·Granted Dec 12, 2023·0 cites·18 claims
- 4163US10770427B1Chip package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 8, 2020·0 cites·20 claims
- 4262US12038591B2Polymer patterned disk stack manufacturingMAGIC LEAP INC·Filed 2020·Granted Jul 16, 2024·0 cites·11 claims
- 4359US10297730B2LED device, method for manufacturing an LED device, and LED display moduleFOSHAN NATIONSTAR OPTOELETRONICS CO LTD·Filed 2017·Granted May 21, 2019·1 cites·15 claims
- 4455US8259060B2Drive current of light source by color sequential methodLI LING·Filed 2009·Granted Sep 4, 2012·0 cites·4 claims
- 4553US11790968B2Spintronic device, SOT-MRAM storage cell, storage array and in-memory computing circuitINST OF MICROELECTRONICS OF THE CHINESE ACADEMY OF SCIENCES·Filed 2020·Granted Oct 17, 2023·0 cites·14 claims
- 4652US2024411984A1Information processing method, information processing system, electronic device and storage mediumBOE TECHNOLOGY GROUP CO LTD·Filed 2023·Application pending·0 cites
- 4752US2009126206A1Circular Saw With Cutting Depth DisplayCHUNG KA WAI·Filed 2007·Application pending·0 cites
- 4851US2024192481A1Cover architectures in curved eyepiece stacks for mixed reality applicationsMAGIC LEAP INC·Filed 2022·Application pending·0 cites
- 4949US2024154074A1Display panel, method for fabricating display panel and displaying deviceBOE TECHNOLOGY GROUP CO LTD·Filed 2021·Application pending·0 cites
- 5048US12224287B2Display substrate and method for manufacturing the same, and display deviceBOE TECHNOLOGY GROUP CO LTD·Filed 2021·Granted Feb 11, 2025·0 cites·18 claims
Showing the top 50 of 75 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →