Inventor · disambiguated record
Lin Chung Liang
Also filed as: LIANG LIN · Liang Lin Chung
10 granted patents·6 pending applications·39 citations·filing 2015–2024
84Inventor score
Files withIBM8SHENZHEN STS MICROELECTRONICS CO LTD4SCHLUMBERGER TECHNOLOGY CORP3TIEDEPING HARDWARE PLASTIC SHENZHEN CO LTD1
Top patents by PatentIndex Score
16 records- 0193US10268340B2Organizing messages in a hierarchical chat room framework based on topicsIBM·Filed 2015·Granted Apr 23, 2019·20 cites·19 claims
- 0291US11159457B2Chatbot orchestrationIBM·Filed 2019·Granted Oct 26, 2021·14 cites·17 claims
- 0377US10205737B2Addressing login platform security risksIBM·Filed 2016·Granted Feb 12, 2019·3 cites·17 claims
- 0476US10684746B2Organizing messages in a hierarchical chat room framework based on topicsIBM·Filed 2019·Granted Jun 16, 2020·2 cites·20 claims
- 0572US12460534B2Magnetic focusing scheme for flux leakage measurementSCHLUMBERGER TECHNOLOGY CORP·Filed 2024·Granted Nov 4, 2025·0 cites·20 claims
- 0661US10552862B2Interruption point determinationIBM·Filed 2017·Granted Feb 4, 2020·0 cites·16 claims
- 0760US11151597B2Interruption point determinationIBM·Filed 2020·Granted Oct 19, 2021·0 cites·16 claims
- 0860US2025109678A1Discrete perforating deviceSCHLUMBERGER TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 0958US2025226301A1Multilayer substrates, power modules, and electrical systemsSHENZHEN STS MICROELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1058US2025226273A1Multilayer substrates and methods for manufacturing same, power modules and methods for manufacturing same, and electrical systemsSHENZHEN STS MICROELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1156US10567418B2Addressing login platform security risksIBM·Filed 2019·Granted Feb 18, 2020·0 cites·17 claims
- 1256US2025220814A1Multilayer printed circuit board for interconnecting pin(s) and semiconductor die(s) and corresponding method for interconnectionSHENZHEN STS MICROELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1355US10367847B2Addressing login platform security risksIBM·Filed 2018·Granted Jul 30, 2019·0 cites·20 claims
- 1449US2024203843A1Semiconductor package, package forming method, and power supply moduleSHENZHEN STS MICROELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1547US2024094429A1Systems and methods for proximity detection and interpretation of near parallel cased wellsSCHLUMBERGER TECHNOLOGY CORP·Filed 2023·Application pending·0 cites
- 1630USD1060911SMulti-functional rubber scraperTIEDEPING HARDWARE PLASTIC SHENZHEN CO LTD·Filed 2023·Granted Feb 4, 2025·0 cites·1 claims
Join the waitlist — get patent alerts
Get an alert when Lin Chung Liang files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →