Inventor · disambiguated record

Ling Mei Lin

Also filed as: LIN LING MEI

2 granted patents·11 citations·filing 2012–2014

54Inventor score

Technology areasH10W

Files withLIN LING MEI1 TAIWAN SEMICONDUCTOR MFG CO LTD1

Top patents by PatentIndex Score

2 records

0181US9627318B2Interconnect structure with footing regionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Apr 18, 2017·9 cites·20 claims
0253US9768132B2Semiconductor structure and method of forming the sameLIN LING MEI·Filed 2012·Granted Sep 19, 2017·2 cites·20 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →