Inventor · disambiguated record
Liane Martinez
Also filed as: MARTINEZ LIANE
9 granted patents·5 pending applications·34 citations·filing 2007–2022
84Inventor score
Files withADVANCED MICRO DEVICES INC4ATI TECHNOLOGIES ULC3MARTINEZ LIANE2TOPACIO RODEN R2LEUNG ANDREW1
Top patents by PatentIndex Score
14 records- 0186US8298945B2Method of manufacturing substrates having asymmetric buildup layersLEUNG ANDREW·Filed 2011·Granted Oct 30, 2012·9 cites·14 claims
- 0280US9209106B2Thermal management circuit board for stacked semiconductor chip deviceSHI XIAO LING·Filed 2012·Granted Dec 8, 2015·10 cites·28 claims
- 0371US8637983B2Face-to-face (F2F) hybrid structure for an integrated circuitMARTINEZ LIANE·Filed 2008·Granted Jan 28, 2014·6 cites·13 claims
- 0467US8012874B2Semiconductor chip substrate with multi-capacitor footprintATI TECHNOLOGIES ULC·Filed 2007·Granted Sep 6, 2011·5 cites·13 claims
- 0560US9607935B2Semiconductor chip package with undermount passive devicesMARTINEZ LIANE·Filed 2009·Granted Mar 28, 2017·2 cites·18 claims
- 0655US12499300B1Systems and methods for generating a floorplan and bump placement for a package designADVANCED MICRO DEVICES INC·Filed 2022·Granted Dec 16, 2025·0 cites·20 claims
- 0750US7847568B2Multi-site probeADVANCED MICRO DEVICES INC·Filed 2007·Granted Dec 7, 2010·2 cites·21 claims
- 0850US2011024898A1Method of manufacturing substrates having asymmetric buildup layersATI TECHNOLOGIES ULC·Filed 2009·Application pending·0 cites
- 0947US11960813B2Automatic redistribution layer via generationADVANCED MICRO DEVICES INC·Filed 2021·Granted Apr 16, 2024·0 cites·20 claims
- 1046US2008245555A1Circuit substrate with plated through hole structure and methodATI TECHNOLOGIES ULC·Filed 2007·Application pending·0 cites
- 1142US8564122B2Circuit board component shim structureMCLELLAN NEIL R·Filed 2011·Granted Oct 22, 2013·0 cites·24 claims
- 1242US2010102457A1Hybrid Semiconductor Chip PackageTOPACIO RODEN R·Filed 2008·Application pending·0 cites
- 1338US2013147026A1Heatsink interposerTOPACIO RODEN R·Filed 2011·Application pending·0 cites
- 1435US2023032595A1Automated redistribution layer power connectionsADVANCED MICRO DEVICES INC·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →