Inventor · disambiguated record
Ling Pan
Also filed as: PAN LING
16 granted patents·23 pending applications·27 citations·filing 2007–2025
88Inventor score
Top patents by PatentIndex Score
39 records- 0179USD1024311SElectric nasal aspiratorPAN LING·Filed 2022·Granted Apr 23, 2024·8 cites·1 claims
- 0279USD1018838SElectric nasal aspiratorPAN LING·Filed 2022·Granted Mar 19, 2024·8 cites·1 claims
- 0377USD1017796SElectric nasal aspiratorPAN LING·Filed 2022·Granted Mar 12, 2024·7 cites·1 claims
- 0475US10981253B2Structure having stress protected groove weld and structural members forming the sameCATERPILLAR INC·Filed 2018·Granted Apr 20, 2021·1 cites·20 claims
- 0575US10688600B2Structure having stress protected groove weld and structural members forming the sameCATERPILLAR INC·Filed 2016·Granted Jun 23, 2020·1 cites·13 claims
- 0675US2025349748A1Methods and apparatus for using spacer-on-spacer design for solder joint reliability improvement in semiconductor devicesMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 0773US2025316915A1Connection designs for memory systemsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 0870US12355167B2Connection designs for memory systemsMICRON TECHNOLOGY INC·Filed 2022·Granted Jul 8, 2025·0 cites·17 claims
- 0969US12368113B2Methods and apparatus for using spacer-on-spacer design for solder joint reliability improvement in semiconductor devicesMICRON TECHNOLOGY INC·Filed 2022·Granted Jul 22, 2025·0 cites·20 claims
- 1068US12412811B2Split via structure for semiconductor device packagingMICRON TECHNOLOGY INC·Filed 2022·Granted Sep 9, 2025·0 cites·18 claims
- 1167US8133912B2Methyl aquocobyrinic acid derivative, alkylation composition, and method for detoxifying a harmful compound by utilizing the compositionNAKAMURA KOICHIRO·Filed 2007·Granted Mar 13, 2012·2 cites·3 claims
- 1265US11253956B2Structure having stress protected groove weld and structural members forming the sameCATERPILLAR INC·Filed 2020·Granted Feb 22, 2022·0 cites·18 claims
- 1362US12506134B2Fan-out packaging for a multichip packageMICRON TECHNOLOGY INC·Filed 2022·Granted Dec 23, 2025·0 cites·24 claims
- 1461US2025203773A1Semiconductor package and methods of formationMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 1560US2025183227A1High-density semiconductor chip packageMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 1660US2024404995A1Apparatus including selectable circuit placement mechanism and methods of manufacturing the sameMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 1759US2024304598A1Microelectronic devices, and related memory device packages and electronic systemsMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 1859US2024312890A1Semiconductor device assemblies with cross-stack structures, and associated methodsMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 1958US12463140B2Flexible interposer for semiconductor diesMICRON TECHNOLOGY INC·Filed 2022·Granted Nov 4, 2025·0 cites·35 claims
- 2058US2024234390A1Stacked microelectronic package with stack mounted components and related methods, devices, and systemsMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 2158US2024234403A1Stacked microelectronic packages including interposer structures and related methods, devices, and systemsMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 2257US2024282751A1Substrates with downsetMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 2357US2024332216A1Molded compound patterns on package ball side to mitigate coplanarity and warpageMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 2456US12476216B2Wire bonding for stacked memory diesMICRON TECHNOLOGY INC·Filed 2022·Granted Nov 18, 2025·0 cites·17 claims
- 2556US2024203842A1Semiconductor device assembly with a circular segmented package edgeMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 2656US2024268132A1Legged support structure to mitigate stacked die overhang deflectionMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 2755US2024194547A1Substrates for semiconductor packagesMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 2855US2024162206A1Load switch mounting for a semiconductor packageMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 2955US2024194630A1Bondable pillars for wire bonds in a semiconductor packageMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 3055US2024162207A1Passive electronic components on a semiconductor dieMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 3154US12053570B2Nasal aspirator suction bin assemblyPAN LING·Filed 2022·Granted Aug 6, 2024·0 cites·8 claims
- 3253US12075583B2Electronic device housing, electronic device, and compound bodyBYD CO LTD·Filed 2019·Granted Aug 27, 2024·0 cites·15 claims
- 3352US2024074048A1Semiconductor packaging with reduced standoff heightMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 3452US2024071990A1Extended bond pad for semiconductor device assembliesMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 3551US2024071881A1Semiconductor packaging with reduced standoff heightMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 3650US2024057265A1Stress-releasing solder mask pattern for semiconductor devices and related systems and methodsMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 3750US2024063201A1Non-conductive film for bonding a flip chip die to a substrateMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 3849US11688662B2Thermal distribution network for semiconductor devices and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2021·Granted Jun 27, 2023·0 cites·20 claims
- 3945US2025266403A1Slanted die stacking to mitigate overhang deflectionMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →