Inventor · disambiguated record
Linas Repecka
Also filed as: REPECKA LINAS · REPECKA LINAS N · REPECKA LINAS NORMAN
6 granted patents·264 citations·filing 1988–2003
87Inventor score
Top patents by PatentIndex Score
6 records- 0192US6391436B1Manufacture of void-free laminates and use thereofCYTEC TECH CORP·Filed 1999·Granted May 21, 2002·115 cites·14 claims
- 0291US5189116AExtremely tough thermosetting bismaleimide resin systemsBASF AG·Filed 1989·Granted Feb 23, 1993·57 cites·25 claims
- 0390US6676882B2Methods of hot-melt resin impregnation of 3-D, woven, textile preformsLOCKHEED CORP·Filed 2001·Granted Jan 13, 2004·37 cites·27 claims
- 0480US5003018ASlurry mixing of bismaleimide resinsBASF AG·Filed 1988·Granted Mar 26, 1991·31 cites·19 claims
- 0571US6911175B2Methods of hot-melt impregnation of 3-D, woven, textile preformsLOCKHEED CORP·Filed 2003·Granted Jun 28, 2005·8 cites·10 claims
- 0659US5747615ASlurry-mixed heat-curable resin systems having superior tack and drapeCYTEC TECH CORP·Filed 1995·Granted May 5, 1998·16 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →