Inventor · disambiguated record
Li-Feng Teng
Also filed as: TENG LI · TENG LI-FENG
37 granted patents·12 pending applications·60 citations·filing 2011–2025
96Inventor score
Top patents by PatentIndex Score
49 records- 0196US11830875B2Method to embed planar FETS with FINFETSTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 28, 2023·2 cites·20 claims
- 0296US10325919B1Mask design for embedded memoryTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 18, 2019·12 cites·20 claims
- 0395US9842848B2Embedded HKMG non-volatile memoryTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 12, 2017·12 cites·20 claims
- 0492US10325918B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 18, 2019·5 cites·20 claims
- 0592US2025359049A1Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0690US10879253B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 29, 2020·3 cites·20 claims
- 0789US12439594B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Oct 7, 2025·0 cites·20 claims
- 0887US10950611B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 16, 2021·3 cites·20 claims
- 0987US2025318260A1Method to embed planar fets with finfetsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1086US10164074B2Semiconductor device with gate electrode embedded in substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·4 cites·20 claims
- 1185US12389672B2Method to embed planar FETs with finFETsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Aug 12, 2025·0 cites·20 claims
- 1285US12058856B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 6, 2024·0 cites·20 claims
- 1383US2024373626A1Array boundary structure to reduce dishingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1482US12127399B2Array boundary structure to reduce dishingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 22, 2024·0 cites·20 claims
- 1582US12015029B2Method to embed planar FETs with finFETsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 18, 2024·0 cites·20 claims
- 1682US8609460B2Semiconductor structure and fabricating method thereofLIU PO-TSUN·Filed 2011·Granted Dec 17, 2013·8 cites·8 claims
- 1781US9876021B2Embedded HKMG non-volatile memoryTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jan 23, 2018·3 cites·20 claims
- 1880US11355493B2Method to embed planar FETs with finFETsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 7, 2022·1 cites·20 claims
- 1980US10283512B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 7, 2019·2 cites·17 claims
- 2079US2024373627A1Multi-type high voltage devices fabrication for embedded memoryTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2177US12507471B2Semiconductor device and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 23, 2025·0 cites·20 claims
- 2276US2025316627A1Bond routing structure for stacked wafersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2376US2025316587A1Semiconductor device having inductor and method of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2475US11825651B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 21, 2023·0 cites·20 claims
- 2575US11706914B2Method of forming an array boundary structure to reduce dishingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 18, 2023·0 cites·20 claims
- 2675US10577643B2Off-target capture reduction in sequencing techniquesILLUMINA INC·Filed 2016·Granted Mar 3, 2020·1 cites·25 claims
- 2773US2023193357A1Off-target capture reduction in sequencing techniquesILLUMINA INC·Filed 2023·Application pending·0 cites
- 2873US2025266379A1Slotted bond pad in stacked wafer structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2972US12096621B2Multi-type high voltage devices fabrication for embedded memoryTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 17, 2024·0 cites·20 claims
- 3071US11758721B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 12, 2023·0 cites·20 claims
- 3171US10943996B2Method of manufacturing semiconductor device including non-volatile memories and logic devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Mar 9, 2021·1 cites·11 claims
- 3270US12322715B2Method of forming integrated chip structure having slotted bond pad in stacked wafer structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 3, 2025·0 cites·20 claims
- 3370US12255133B2Electrical fuse (e-fuse) one-time programmable (OTP) device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 18, 2025·0 cites·20 claims
- 3470US11594620B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 28, 2023·0 cites·20 claims
- 3568US11742348B2Semiconductor device and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 29, 2023·0 cites·20 claims
- 3668US2025183162A1Semiconductor device with electrical fuseTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3768US2024071911A1Semiconductor device having inductor and method of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3866US2023260942A1Bond routing structure for stacked wafersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 3964US11624084B2Off-target capture reduction in sequencing techniquesILLUMINA INC·Filed 2020·Granted Apr 11, 2023·0 cites·12 claims
- 4064US11264396B2Multi-type high voltage devices fabrication for embedded memoryTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 1, 2022·0 cites·20 claims
- 4162US8563974B2High-gain complementary inverter with ambipolar thin film transistors and fabrication thereofLIU PO-TSUN·Filed 2011·Granted Oct 22, 2013·2 cites·10 claims
- 4260US11211388B2Array boundfary structure to reduce dishingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 28, 2021·0 cites·20 claims
- 4360US8969868B2Thin film transistor with UV light absorber layerUNIV NAT CHIAO TUNG·Filed 2013·Granted Mar 3, 2015·1 cites·7 claims
- 4459US10950715B2Method of manufacturing semiconductor device including non-volatile memories and logic devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Mar 16, 2021·0 cites·20 claims
- 4558US2025155659A1Photonic package and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4656US11600618B2Integrated circuit structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 7, 2023·0 cites·20 claims
- 4756US11282846B2Mask design for embedded memoryTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 22, 2022·0 cites·20 claims
- 4844US8975164B2Method of manufacturing semiconductor deviceUNIV NAT CHIAO TUNG·Filed 2013·Granted Mar 10, 2015·0 cites·5 claims
- 4934US9093427B2Method for fabricating semiconductor deviceUNIV NAT CHIAO TUNG·Filed 2013·Granted Jul 28, 2015·0 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →