Inventor · disambiguated record
Ling-Chun Tseng
Also filed as: TSENG LING-CHUN
2 granted patents·2 pending applications·0 citations·filing 2019–2025
25Inventor score
Files withWINBOND ELECTRONICS CORP4
Top patents by PatentIndex Score
4 records- 0165US2025266349A1Semiconductor memory structureWINBOND ELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 0259US12322698B2Semiconductor memory structure and method for forming the sameWINBOND ELECTRONICS CORP·Filed 2021·Granted Jun 3, 2025·0 cites·18 claims
- 0343US11527475B2Memory devices and methods for forming the sameWINBOND ELECTRONICS CORP·Filed 2020·Granted Dec 13, 2022·0 cites·15 claims
- 0436US2019334084A1Resistive random access memory structure and manufacturing method thereofWINBOND ELECTRONICS CORP·Filed 2019·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Ling-Chun Tseng files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →