Inventor · disambiguated record
Li-Ya Tseng
Also filed as: TSENG LI-YA
2 granted patents·2 pending applications·0 citations·filing 2019–2024
22Inventor score
Technology areasH10W
Files withGLOBAL UNICHIP CORP4
Top patents by PatentIndex Score
4 records- 0156US2025349695A1Substrate structure and semiconductor packageGLOBAL UNICHIP CORP·Filed 2024·Application pending·0 cites
- 0256US2025385191A1Semiconductor package device and semiconductor wiring substrate thereofGLOBAL UNICHIP CORP·Filed 2024·Application pending·0 cites
- 0348US11742295B2Interface of integrated circuit die and method for arranging interface thereofGLOBAL UNICHIP CORP·Filed 2020·Granted Aug 29, 2023·0 cites·18 claims
- 0441US11037886B2Semiconductor structure of work unit moduleGLOBAL UNICHIP CORP·Filed 2019·Granted Jun 15, 2021·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →