Inventor · disambiguated record
Liang Wang
Also filed as: WANG LIANG · WANG LIANG-SHU
119 granted patents·25 pending applications·2,233 citations·filing 2004–2025
99Inventor score
Files withINVENSAS CORP82ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC18INVENSAS BONDING TECH INC15ADEIA SEMICONDUCTOR TECH LLC7WANG LIANG6
Top patents by PatentIndex Score
144 records- 0198US12100684B2Bonded structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Granted Sep 24, 2024·3 cites·26 claims
- 0298US11860415B2Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnectsADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2021·Granted Jan 2, 2024·9 cites·17 claims
- 0398US11715730B2Direct-bonded LED arrays including optical elements configured to transmit optical signals from LED elementsADEIA SEMICONDUCTOR TECH LLC·Filed 2021·Granted Aug 1, 2023·6 cites·19 claims
- 0498US11670615B2Bonded structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2020·Granted Jun 6, 2023·6 cites·23 claims
- 0598US11600542B2Cavity packagesADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2021·Granted Mar 7, 2023·6 cites·23 claims
- 0698US11515279B2Low temperature bonded structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2020·Granted Nov 29, 2022·10 cites·22 claims
- 0798US11387214B2Multi-chip modules formed using wafer-level processing of a reconstituted waferINVENSAS LLC·Filed 2019·Granted Jul 12, 2022·61 cites·20 claims
- 0898US11380597B2Bonded structuresINVENSAS BONDING TECH INC·Filed 2018·Granted Jul 5, 2022·57 cites·19 claims
- 0998US11329034B2Direct-bonded LED structure contacts and substrate contactsINVENSAS CORP·Filed 2020·Granted May 10, 2022·146 cites·23 claims
- 1098US11296044B2Bond enhancement structure in microelectronics for trapping contaminants during direct-bonding processesINVENSAS BONDING TECH INC·Filed 2019·Granted Apr 5, 2022·80 cites·24 claims
- 1198US11169326B2Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnectsINVENSAS BONDING TECH INC·Filed 2019·Granted Nov 9, 2021·60 cites·22 claims
- 1298US11056390B2Structures and methods for reliable packagesINVENSAS CORP·Filed 2019·Granted Jul 6, 2021·38 cites·22 claims
- 1398US11011503B2Direct-bonded optoelectronic interconnect for high-density integrated photonicsINVENSAS BONDING TECH INC·Filed 2018·Granted May 18, 2021·148 cites·17 claims
- 1498US10923408B2Cavity packagesINVENSAS BONDING TECH INC·Filed 2018·Granted Feb 16, 2021·133 cites·17 claims
- 1598US10790262B2Low temperature bonded structuresINVENSAS BONDING TECH INC·Filed 2019·Granted Sep 29, 2020·160 cites·13 claims
- 1698US10522499B2Bonded structuresINVENSAS BONDING TECH INC·Filed 2017·Granted Dec 31, 2019·137 cites·28 claims
- 1798US10508030B2Seal for microelectronic assemblyINVENSAS BONDING TECH INC·Filed 2018·Granted Dec 17, 2019·124 cites·14 claims
- 1898US10002844B1Bonded structuresINVENSAS BONDING TECH INC·Filed 2016·Granted Jun 19, 2018·167 cites·20 claims
- 1998US9824974B2Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assembliesINVENSAS CORP·Filed 2016·Granted Nov 21, 2017·54 cites·20 claims
- 2098US9741620B2Structures and methods for reliable packagesINVENSAS CORP·Filed 2015·Granted Aug 22, 2017·186 cites·20 claims
- 2198US9666559B2Multichip modules and methods of fabricationINVENSAS CORP·Filed 2015·Granted May 30, 2017·70 cites·19 claims
- 2298US9478504B1Microelectronic assemblies with cavities, and methods of fabricationINVENSAS CORP·Filed 2015·Granted Oct 25, 2016·64 cites·10 claims
- 2398US9397038B1Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substratesINVENSAS CORP·Filed 2015·Granted Jul 19, 2016·27 cites·25 claims
- 2498US9165793B1Making electrical components in handle wafers of integrated circuit packagesINVENSAS CORP·Filed 2014·Granted Oct 20, 2015·141 cites·20 claims
- 2597US12046571B2Low temperature bonded structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Granted Jul 23, 2024·3 cites·5 claims
- 2697US11948847B2Bonded structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Granted Apr 2, 2024·3 cites·33 claims
- 2797US11114408B2System and method for providing 3D wafer assembly with known-good-diesINVENSAS CORP·Filed 2019·Granted Sep 7, 2021·20 cites·11 claims
- 2897US10217720B2Multi-chip modules formed using wafer-level processing of a reconstitute waferINVENSAS CORP·Filed 2017·Granted Feb 26, 2019·18 cites·9 claims
- 2997US9356006B2Batch process fabrication of package-on-package microelectronic assembliesINVENSAS CORP·Filed 2015·Granted May 31, 2016·18 cites·17 claims
- 3097US9324626B2Interposers with circuit modules encapsulated by moldable material in a cavity, and methods of fabricationINVENSAS CORP·Filed 2014·Granted Apr 26, 2016·30 cites·30 claims
- 3196US11257727B2Seal for microelectronic assemblyINVENSAS BONDING TECH INC·Filed 2019·Granted Feb 22, 2022·9 cites·20 claims
- 3296US10629577B2Direct-bonded LED arrays and applicationsINVENSAS CORP·Filed 2018·Granted Apr 21, 2020·11 cites·14 claims
- 3396US9437536B1Reversed build-up substrate for 2.5DINVENSAS CORP·Filed 2015·Granted Sep 6, 2016·12 cites·24 claims
- 3495US11417576B2Seal for microelectronic assemblyINVENSAS BONDING TECH INC·Filed 2019·Granted Aug 16, 2022·7 cites·19 claims
- 3595US10546832B2Bonded structuresINVENSAS BONDING TECH INC·Filed 2018·Granted Jan 28, 2020·5 cites·20 claims
- 3695US9691696B2Interposers with circuit modules encapsulated by moldable material in a cavity, and methods of fabricationINVENSAS CORP·Filed 2016·Granted Jun 27, 2017·10 cites·20 claims
- 3794US10163833B2Multichip modules and methods of fabricationINVENSAS CORP·Filed 2017·Granted Dec 25, 2018·10 cites·14 claims
- 3893US10879207B2Bonded structuresINVENSAS BONDING TECH INC·Filed 2019·Granted Dec 29, 2020·5 cites·21 claims
- 3993US10546834B2Multi-chip modules formed using wafer-level processing of a reconstituted waferINVENSAS CORP·Filed 2019·Granted Jan 28, 2020·6 cites·13 claims
- 4093US9953957B2Embedded graphite heat spreader for 3DICINVENSAS CORP·Filed 2015·Granted Apr 24, 2018·10 cites·19 claims
- 4193US9548273B2Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assembliesINVENSAS CORP·Filed 2015·Granted Jan 17, 2017·10 cites·20 claims
- 4292US12322667B2Seal for microelectronic assemblyADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Granted Jun 3, 2025·1 cites·14 claims
- 4392US10879210B2Bonded structuresINVENSAS BONDING TECH INC·Filed 2019·Granted Dec 29, 2020·7 cites·28 claims
- 4492US10332854B2Anchoring structure of fine pitch bvaINVENSAS CORP·Filed 2016·Granted Jun 25, 2019·10 cites·7 claims
- 4592US9412806B2Making multilayer 3D capacitors using arrays of upstanding rods or ridgesINVENSAS CORP·Filed 2014·Granted Aug 9, 2016·12 cites·15 claims
- 4692US9214454B2Batch process fabrication of package-on-package microelectronic assembliesINVENSAS CORP·Filed 2014·Granted Dec 15, 2015·12 cites·12 claims
- 4792US8816383B2High performance light emitting diode with viasINVENSAS CORP·Filed 2012·Granted Aug 26, 2014·7 cites·20 claims
- 4891US2025343086A1Seal for microelectronic assemblyADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2025·Application pending·0 cites
- 4991US2025105234A1Direct-bonded led arrays and driver circuitsADEIA SEMICONDUCTOR TECH LLC·Filed 2024·Application pending·0 cites
- 5090US10586785B2Embedded graphite heat spreader for 3DICINVENSAS CORP·Filed 2018·Granted Mar 10, 2020·5 cites·20 claims
Showing the top 50 of 144 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →