Inventor · disambiguated record
Li-Sheng Weng
Also filed as: WENG LI-SHENG
19 granted patents·4 pending applications·8 citations·filing 2015–2024
88Inventor score
Top patents by PatentIndex Score
23 records- 0193US12136613B2Chip package with near-die integrated passive deviceXILINX INC·Filed 2022·Granted Nov 5, 2024·2 cites·20 claims
- 0285US10510667B2Conductive coating for a microelectronics packageINTEL CORP·Filed 2016·Granted Dec 17, 2019·4 cites·20 claims
- 0382US11594491B2Multi-die interconnectQUALCOMM INC·Filed 2021·Granted Feb 28, 2023·1 cites·24 claims
- 0473US10910314B2Conductive coating for a microelectronics packageINTEL CORP·Filed 2019·Granted Feb 2, 2021·1 cites·20 claims
- 0563US12482715B2Chip package with core embedded integrated passive deviceXILINX INC·Filed 2022·Granted Nov 25, 2025·0 cites·20 claims
- 0663US2025192128A1Artificial Intelligence Engine and Memory InteroperationGOOGLE LLC·Filed 2024·Application pending·0 cites
- 0763US2025167186A1Efficient Fan-Out (FO) Space Utilization in Package-On-Package (POP) AssembliesGOOGLE LLC·Filed 2024·Application pending·0 cites
- 0862US12463143B2Chip package with core embedded integrated devicesXILINX INC·Filed 2022·Granted Nov 4, 2025·0 cites·20 claims
- 0955US10658198B2Solder resist layer structures for terminating de-featured components and methods of making the sameINTEL CORP·Filed 2019·Granted May 19, 2020·0 cites·15 claims
- 1054US12354978B2Coupled loop and void structure integrated in a redistribution layer of a chip packageXILINX INC·Filed 2022·Granted Jul 8, 2025·0 cites·20 claims
- 1152US11605594B2Package comprising a substrate and a high-density interconnect integrated device coupled to the substrateQUALCOMM INC·Filed 2020·Granted Mar 14, 2023·0 cites·26 claims
- 1252US11380613B2Repurposed seed layer for high frequency noise control and electrostatic discharge connectionQUALCOMM INC·Filed 2020·Granted Jul 5, 2022·0 cites·12 claims
- 1350US11784157B2Package comprising integrated devices coupled through a metallization layerQUALCOMM INC·Filed 2021·Granted Oct 10, 2023·0 cites·33 claims
- 1449US12469811B2Package comprising wire bonds coupled to integrated devicesQUALCOMM INC·Filed 2021·Granted Nov 11, 2025·0 cites·25 claims
- 1549US11139224B2Package comprising a substrate having a via wall configured as a shieldQUALCOMM INC·Filed 2019·Granted Oct 5, 2021·0 cites·22 claims
- 1648US12431416B2Chip package with integrated current controlXILINX INC·Filed 2022·Granted Sep 30, 2025·0 cites·20 claims
- 1747US9900976B1Integrated circuit package including floating package stiffenerINTEL CORP·Filed 2016·Granted Feb 20, 2018·0 cites·18 claims
- 1846US2022199547A1FAN-OUT WAFER-LEVEL PACKAGING (FOWLP) INTEGRATED CIRCUITS (ICs) EMPLOYING AN ELECTRO-MAGNETIC INTERFERENCE (EMI) SHIELD STRUCTURE IN UNUSED FAN-OUT AREA FOR EMI SHIELDING, AND RELATED FABRICATION METHODSQUALCOMM INC·Filed 2020·Application pending·0 cites
- 1945US12355000B2Package comprising a substrate and a high-density interconnect integrated deviceQUALCOMM INC·Filed 2020·Granted Jul 8, 2025·0 cites·32 claims
- 2045US11189574B2Microelectronic package having electromagnetic interference shieldingINTEL CORP·Filed 2017·Granted Nov 30, 2021·0 cites·24 claims
- 2145US10244632B2Solder resist layer structures for terminating de-featured components and methods of making the sameINTEL CORP·Filed 2017·Granted Mar 26, 2019·0 cites·14 claims
- 2243US11676922B2Integrated device comprising interconnect structures having an inner interconnect, a dielectric layer and a conductive layerQUALCOMM INC·Filed 2019·Granted Jun 13, 2023·0 cites·28 claims
- 2329US2016268213A1On Package Floating Metal/Stiffener Grounding to Mitigate RFI and SI RisksINTEL CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →