Inventor · disambiguated record
Li-Chieh Wu
Also filed as: WU LI-CHIEH
32 granted patents·4 pending applications·50 citations·filing 2012–2024
95Inventor score
Top patents by PatentIndex Score
36 records- 0192US9859165B1Planarization process for forming semiconductor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 2, 2018·8 cites·20 claims
- 0291US9209272B2Oxidation and etching post metal gate CMPTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Dec 8, 2015·10 cites·20 claims
- 0390US9917173B2Oxidation and etching post metal gate CMPTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Mar 13, 2018·5 cites·20 claims
- 0489US9449841B2Methods and systems for chemical mechanical polish and cleanTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Sep 20, 2016·8 cites·19 claims
- 0587US9564511B2Oxidation and etching post metal gate CMPTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 7, 2017·4 cites·20 claims
- 0686US10643892B2Metal loss prevention using implantationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 5, 2020·3 cites·20 claims
- 0785US11211289B2Metal loss prevention using implantationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 28, 2021·2 cites·20 claims
- 0884US11482450B2Methods of forming an abrasive slurry and methods for chemical- mechanical polishingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 25, 2022·1 cites·20 claims
- 0984US9076766B2Mechanism for forming metal gate structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jul 7, 2015·5 cites·20 claims
- 1083US12506034B2Polishing interconnect structures in semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Dec 23, 2025·0 cites·20 claims
- 1183US12068195B2Metal loss prevention using implantationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 20, 2024·0 cites·20 claims
- 1281US11996283B2Method for metal gate surface cleanTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 28, 2024·0 cites·20 claims
- 1379US10109523B2Method of cleaning wafer after CMPTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 23, 2018·2 cites·20 claims
- 1477US11710659B2Metal loss prevention using implantationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 25, 2023·0 cites·20 claims
- 1576US12002684B2Methods for chemical mechanical polishing and forming interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 4, 2024·0 cites·20 claims
- 1676US2024290629A1Methods for chemical mechanical polishing and forming interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1774US11978664B2Polishing interconnect structures in semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 7, 2024·0 cites·20 claims
- 1874US11410846B2Method for metal gate surface cleanTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 9, 2022·0 cites·20 claims
- 1974US10937691B2Methods of forming an abrasive slurry and methods for chemical-mechanical polishingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 2, 2021·1 cites·20 claims
- 2070US9269585B2Method for cleaning metal gate surfaceTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Feb 23, 2016·1 cites·20 claims
- 2168US11430691B2Polishing interconnect structures in semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 30, 2022·0 cites·20 claims
- 2267US11532514B2Structure and formation method of semiconductor device with conductive featureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 20, 2022·0 cites·20 claims
- 2367US11508585B2Methods for chemical mechanical polishing and forming interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 22, 2022·0 cites·20 claims
- 2464US10755934B2Systems and methods for chemical mechanical polish and cleanTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 25, 2020·0 cites·20 claims
- 2563US10916473B2Method of cleaning wafer after CMPTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Feb 9, 2021·0 cites·19 claims
- 2660US10847359B2Method for metal gate surface cleanTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 24, 2020·0 cites·20 claims
- 2758US10957587B2Structure and formation method of semiconductor device with conductive featureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 23, 2021·0 cites·20 claims
- 2858US10510594B2Method of cleaning wafer after CMPTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·0 cites·20 claims
- 2958US9633832B2Method for metal gate surface cleanTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 25, 2017·0 cites·20 claims
- 3057US11658065B2Chemical mechanical polishing slurry composition, method for chemical mechanical polishing and method for forming connecting structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 23, 2023·0 cites·20 claims
- 3157US2025038008A1Methods for chemical mechanical polishing and methods for forming an interconnect structure of a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3256US12297375B2Slurry composition and method for polishing and integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 13, 2025·0 cites·20 claims
- 3355US10515808B2Systems and methods for chemical mechanical polish and cleanTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 24, 2019·0 cites·20 claims
- 3452US9553161B2Mechanism for forming metal gate structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jan 24, 2017·0 cites·20 claims
- 3543US2015087144A1Apparatus and method of manufacturing metal gate semiconductor deviceTAIWAN SEMICONDUCTOR MFG·Filed 2013·Application pending·0 cites
- 3641US2013112909A1Highly efficient thermoelectric materialLIAO CHIEN-NENG·Filed 2012·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Li-Chieh Wu files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →