Inventor · disambiguated record

Lijun Yi

Also filed as: YI LIJUN

1 granted patent·0 citations·filing 2016–2016

8Inventor score

Technology areasH05K

Files withGUANGZHOU FASTPRINT CIRCUIT TECH CO LTD1

Top patents by PatentIndex Score

1 record

0137US10614386B2PCB board assembling method and assembling systemGUANGZHOU FASTPRINT CIRCUIT TECH CO LTD·Filed 2016·Granted Apr 7, 2020·0 cites·10 claims

Join the waitlist — get patent alerts

Get an alert when Lijun Yi files or is granted a new patent.

We store only your email — no account needed. See our privacy policy.

Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →