Inventor · disambiguated record
Li-Chih Yu
Also filed as: YU LI · YU LI-CHIH
14 granted patents·4 pending applications·24 citations·filing 2011–2023
86Inventor score
Files withELITE MATERIAL CO LTD5ELITE ELECTRONIC MATERIAL ZHONGSHAN CO LTD3YU LI-CHIH3EATON ELECTRICAL EQUIPMENT CO LTD1EATON INTELLIGENT POWER LTD1
Top patents by PatentIndex Score
18 records- 0191US9422412B2Halogen-free resin composition and copper clad laminate and printed circuit board using sameYU LI-CHIH·Filed 2011·Granted Aug 23, 2016·9 cites·7 claims
- 0289US8404764B1Resin composition and prepreg, laminate and circuit board thereofYU LI-CHIH·Filed 2011·Granted Mar 26, 2013·11 cites·11 claims
- 0366US9545018B2Multi-layer printed circuit boards with dimensional stabilityELITE MATERIAL CO LTD·Filed 2014·Granted Jan 10, 2017·2 cites·10 claims
- 0459US2023368938A1Gas mixture including a fluorinated nitrile for gas-insulated switchgearEATON INTELLIGENT POWER LTD·Filed 2023·Application pending·0 cites
- 0558US12482091B2Detecting defects on specimensKLA CORP·Filed 2022·Granted Nov 25, 2025·0 cites·23 claims
- 0657US9394438B2Resin composition, copper-clad laminate and printed circuit board for use therewithELITE MATERIAL CO LTD·Filed 2013·Granted Jul 19, 2016·0 cites·6 claims
- 0757US9238733B2Halogen-free resin compositionELITE ELECTRONIC MATERIAL ZHONGSHAN CO LTD·Filed 2012·Granted Jan 19, 2016·1 cites·7 claims
- 0856US10073141B2Detecting method and apparatus for abnormal electrical connection in main circuit of switchgearEATON ELECTRICAL EQUIPMENT CO LTD·Filed 2015·Granted Sep 11, 2018·1 cites·16 claims
- 0954US9279051B2Halogen-free resin composition, and copper clad laminate and printed circuit board using sameELITE MATERIAL CO LTD·Filed 2012·Granted Mar 8, 2016·0 cites·10 claims
- 1053US9392683B2Multi-layer printed circuit boards having properties suitable for layer reduction designELITE MATERIAL CO LTD·Filed 2014·Granted Jul 12, 2016·0 cites·9 claims
- 1152US12092601B2Construction method for photocathode indirect competition sensor and evaluation methodOIL CROPS RES INSTITUTE OF CHINESE ACADEMY OF AGRICULTURAL SCIENCES·Filed 2023·Granted Sep 17, 2024·0 cites·6 claims
- 1251US9650512B2Halogen-free resin composition, copper clad laminate using the same, and printed circuit board using the sameELITE ELECTRONIC MAT (KUNSHAN) CO LTD·Filed 2013·Granted May 16, 2017·0 cites·8 claims
- 1350US9185801B2Halogen-free resin composition, copper clad laminate using the same, and printed circuit board using the sameELITE ELECTRONIC MATERIAL ZHONGSHAN CO LTD·Filed 2013·Granted Nov 10, 2015·0 cites·10 claims
- 1448US2023015069A1Folding platform type bicycle carrierSHENZHEN SUNCENT AUTO PARTS TECH COMPANY LIM·Filed 2022·Application pending·0 cites
- 1547US9955569B2Multi-layer printed circuit boards with dimensional stabilityELITE MATERIAL CO LTD·Filed 2016·Granted Apr 24, 2018·0 cites·13 claims
- 1641US9288904B2Halogen-free resin composition, copper clad laminate using the same, and printed circuit board using the sameELITE ELECTRONIC MATERIAL KUNSHAN CO LTD·Filed 2013·Granted Mar 15, 2016·0 cites·9 claims
- 1739US2011274877A1Method for manufacturing metal base laminateYU LI-CHIH·Filed 2011·Application pending·0 cites
- 1823US2016165714A1Multi-layer printed circuit boards with low warpageELITE ELECTRONIC MATERIAL ZHONGSHAN CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →