Inventor · disambiguated record
Lloyd Burrell
Also filed as: BURRELL LLOYD · BURRELL LLOYD G
10 granted patents·1 pending application·183 citations·filing 2001–2022
90Inventor score
Top patents by PatentIndex Score
11 records- 0193US7250311B2Wirebond crack sensor for low-k dieIBM·Filed 2005·Granted Jul 31, 2007·31 cites·14 claims
- 0288US6908841B2Support structures for wirebond regions of contact pads over low modulus materialsIBM·Filed 2002·Granted Jun 21, 2005·56 cites·36 claims
- 0381US6559042B2Process for forming fusible linksIBM·Filed 2001·Granted May 6, 2003·33 cites·5 claims
- 0476US6960831B2Semiconductor device having a composite layer in addition to a barrier layer between copper wiring and aluminum bond padIBM·Filed 2003·Granted Nov 1, 2005·25 cites·12 claims
- 0574US7294565B2Method of fabricating a wire bond pad with Ni/Au metallizationIBM·Filed 2003·Granted Nov 13, 2007·18 cites·20 claims
- 0673US7867820B2Methods for forming co-planar wafer-scale chip packagesIBM·Filed 2008·Granted Jan 11, 2011·3 cites·8 claims
- 0770US7405108B2Methods for forming co-planar wafer-scale chip packagesIBM·Filed 2004·Granted Jul 29, 2008·11 cites·41 claims
- 0862US12334461B2Bonding structure using two oxide layers with different stress levels, and related methodGLOBALFOUNDRIES US INC·Filed 2022·Granted Jun 17, 2025·0 cites·20 claims
- 0950US7087997B2Copper to aluminum interlayer interconnect using stud and via linerIBM·Filed 2001·Granted Aug 8, 2006·4 cites·8 claims
- 1049US2008073790A1METHOD OF FABRICATING A WIRE BOND PAD WITH Ni/Au METALLIZATIONIBM·Filed 2007·Application pending·0 cites
- 1147US7037824B2Copper to aluminum interlayer interconnect using stud and via linerIBM·Filed 2004·Granted May 2, 2006·2 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →