Inventor · disambiguated record
Louis Difrancesco
Also filed as: DIFRANCESCO LOUIS
13 granted patents·2 pending applications·1,070 citations·filing 1987–2002
95Inventor score
Files withPARTICLE INTERCONNECT INC6DIFRANCESCO LOUIS3PARTICLE INTERCONNECT CORP3NANOPIERCE TECHNOLOGIES INC2
Top patents by PatentIndex Score
15 records- 0197US5083697AParticle-enhanced joining of metal surfacesDIFRANCESCO LOUIS·Filed 1990·Granted Jan 28, 1992·289 cites·39 claims
- 0297US4804132AMethod for cold bondingDIFRANCESCO LOUIS·Filed 1987·Granted Feb 14, 1989·240 cites·18 claims
- 0393US5642055AElectrical interconnect using particle enhanced joining of metal surfacesPARTICLE INTERCONNECT INC·Filed 1995·Granted Jun 24, 1997·107 cites·1 claims
- 0493US5430614AElectrical interconnect using particle enhanced joining of metal surfacesPARTICLE INTERCONNECT INC·Filed 1993·Granted Jul 4, 1995·150 cites·12 claims
- 0587US5471151AElectrical interconnect using particle enhanced joining of metal surfacesPARTICLE INTERCONNECT INC·Filed 1992·Granted Nov 28, 1995·86 cites·28 claims
- 0686US5506514AElectrical interconnect using particle enhanced joining of metal surfacesPARTICLE INTERCONNECT INC·Filed 1995·Granted Apr 9, 1996·60 cites·1 claims
- 0776US5334809AParticle enhanced joining of metal surfacesPARTICLE INTERCONNECT INC·Filed 1993·Granted Aug 2, 1994·33 cites·21 claims
- 0873US5835359AElectrical interconnect using particle enhanced joining of metal surfacesPARTICLE INTERCONNECT CORP·Filed 1996·Granted Nov 10, 1998·27 cites·17 claims
- 0966US5670251APatternable particle filled adhesive matrix for forming patterned structures between joined surfacesPARTICLE INTERCONNECT CORP·Filed 1994·Granted Sep 23, 1997·25 cites·10 claims
- 1064US5565280AElectrical interconnect using particle enhanced joining of metal surfacesPARTICLE INTERCONNECT INC·Filed 1995·Granted Oct 15, 1996·18 cites·3 claims
- 1160US5634265AElectrical interconnect using particle enhanced joining of metal surfacesPARTICLE INTERCONNECT CORP·Filed 1995·Granted Jun 3, 1997·16 cites·3 claims
- 1257US6284108B1Method and apparatus for momentum platingDIFRANCESCO LOUIS·Filed 1998·Granted Sep 4, 2001·12 cites·23 claims
- 1339US6096982AMethod and apparatus for conductively joining componentsNANOPIERCE TECHNOLOGIES INC·Filed 1998·Granted Aug 1, 2000·7 cites·16 claims
- 1437US2001033179A1Method and apparatus for handling electronic devicesFiled 2001·Application pending·0 cites
- 1534US2002158646A1Spiral leaf spring contactsNANOPIERCE TECHNOLOGIES INC·Filed 2002·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Louis Difrancesco files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →