Inventor · disambiguated record
Logan Jae Hwang
Also filed as: HWANG LOGAN JAE
10 granted patents·1 pending application·31 citations·filing 2018–2023
81Inventor score
Top patents by PatentIndex Score
11 records- 0195US10466273B1Socket device for testing ICHWANG DONG WEON·Filed 2018·Granted Nov 5, 2019·25 cites·8 claims
- 0293US11668744B2Contact and socket device for burning-in and testing semiconductor ICHICON CO LTD·Filed 2021·Granted Jun 6, 2023·4 cites·50 claims
- 0387US11561241B2Spring contact and test socket with sameHICON CO LTD·Filed 2020·Granted Jan 24, 2023·2 cites·4 claims
- 0472US11982688B2Spring contact and test socket with sameHICON CO LTD·Filed 2022·Granted May 14, 2024·0 cites·2 claims
- 0568US12392798B2Socket device for testing ICSHWANG DONG WEON·Filed 2023·Granted Aug 19, 2025·0 cites·8 claims
- 0656US2024069607A1Memory module socketHWANG DONG WEON·Filed 2023·Application pending·0 cites
- 0754US12061212B2Spring contact and socket having spring contact embedded thereinHWANG DONG WEON·Filed 2019·Granted Aug 13, 2024·0 cites·10 claims
- 0850US10971843B2BGA socket device for testing BGA ICHWANG DONG WEON·Filed 2019·Granted Apr 6, 2021·0 cites·17 claims
- 0948US11387584B1Contact pin for testing semiconductor IC for high speed signal, spring contact including same, and socket deviceHICON CO LTD·Filed 2021·Granted Jul 12, 2022·0 cites·22 claims
- 1047US10955438B2Contact and socket device for testing semiconductorHWANG DONG WEON·Filed 2018·Granted Mar 23, 2021·0 cites·16 claims
- 1139US12248001B2Lidless BGA socket apparatus for testing semiconductor deviceHICON CO LTD·Filed 2019·Granted Mar 11, 2025·0 cites·30 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →