Inventor · disambiguated record
Logeeswaran Veerayah Jayaraman
Also filed as: JAYARAMAN LOGEESWARAN V · JAYARAMAN LOGEESWARAN VEERAYAH
8 granted patents·3 pending applications·45 citations·filing 2007–2022
81Inventor score
Top patents by PatentIndex Score
11 records- 0195US7446929B1Photonic device including at least one electromagnetic resonator operably coupled to a state-change materialHEWLETT PACKARD DEVELOPMENT CO·Filed 2007·Granted Nov 4, 2008·35 cites·20 claims
- 0292US11186479B2Systems and methods for operating a MEMS device based on sensed temperature gradientsINVENSENSE INC·Filed 2019·Granted Nov 30, 2021·6 cites·14 claims
- 0388US11073531B2Vertical thermal gradient compensation in a z-axis MEMS accelerometerINVENSENSE INC·Filed 2019·Granted Jul 27, 2021·4 cites·20 claims
- 0480US12319562B2Systems and methods for providing getters in microelectromechanical systemsINVENSENSE INC·Filed 2022·Granted Jun 3, 2025·0 cites·14 claims
- 0578US11738994B2Systems and methods for operating a mems device based on sensed temperature gradientsINVENSENSE INC·Filed 2022·Granted Aug 29, 2023·0 cites·18 claims
- 0673US11548780B2Systems and methods for operating a MEMS device based on sensed temperature gradientsINVENSENSE INC·Filed 2021·Granted Jan 10, 2023·0 cites·21 claims
- 0767US11945713B2Systems and methods for providing getters in microelectromechanical systemsINVENSENSE INC·Filed 2019·Granted Apr 2, 2024·0 cites·10 claims
- 0856US2016016322A1Blade with a varying cutting angleUNIV CALIFORNIA·Filed 2014·Application pending·0 cites
- 0952US2018161998A1Blade with a varying cutting angleUNIV CALIFORNIA·Filed 2018·Application pending·0 cites
- 1049US10505006B2Proof mass and polysilicon electrode integrated thereonINVENSENSE INC·Filed 2018·Granted Dec 10, 2019·0 cites·20 claims
- 1144US2011036396A1Method and apparatus for fabricating optoelectromechanical devices by structural transfer using re-usable substrateUNIV CALIFORNIA·Filed 2009·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →