Inventor · disambiguated record
Louis H. Liang
Also filed as: LIANG LOUIS · LIANG LOUIS H
30 granted patents·1 pending application·3,125 citations·filing 1990–2001
98Inventor score
Top patents by PatentIndex Score
31 records- 0198US5532612AMethods and apparatus for test and burn-in of integrated circuit devicesFiled 1994·Granted Jul 2, 1996·216 cites·42 claims
- 0297US6373965B1Apparatus and methods for authentication using partially fluorescent graphic images and OCR charactersANGSTROM TECHNOLOGIES INC·Filed 1999·Granted Apr 16, 2002·308 cites·26 claims
- 0397US5719948AApparatus and methods for fluorescent imaging and optical character readingANGSTROM TECHNOLOGIES INC·Filed 1994·Granted Feb 17, 1998·247 cites·6 claims
- 0497US5332864AIntegrated circuit package having an interposerVLSI TECHNOLOGY INC·Filed 1991·Granted Jul 26, 1994·302 cites·17 claims
- 0596US5867586AApparatus and methods for fluorescent imaging and optical character readingANGSTROM TECHNOLOGIES INC·Filed 1997·Granted Feb 2, 1999·256 cites·17 claims
- 0696US5605738ATamper resistant system using ultraviolet fluorescent chemicalsANGSTROM TECHNOLOGIES INC·Filed 1993·Granted Feb 25, 1997·109 cites·24 claims
- 0796US5414299ASemi-conductor device interconnect package assembly for improved package performanceVLSI TECHNOLOGY INC·Filed 1993·Granted May 9, 1995·250 cites·27 claims
- 0895US5414258AApparatus and method for calibration of fluorescence detectorsANGSTROM TECHNOLOGIES INC·Filed 1993·Granted May 9, 1995·159 cites·34 claims
- 0994US5714291ASystem for authenticating printed or reproduced documentsMARINELLO DANIEL·Filed 1993·Granted Feb 3, 1998·65 cites·21 claims
- 1091US5442234AApparatus for thermally coupling a heat sink to a leadframeVLSI TECHNOLOGY INC·Filed 1994·Granted Aug 15, 1995·100 cites·10 claims
- 1190US5378924AApparatus for thermally coupling a heat sink to a lead frameVLSI TECHNOLOGY INC·Filed 1993·Granted Jan 3, 1995·93 cites·38 claims
- 1288US5548106AMethods and apparatus for authenticating data storage articlesANGSTROM TECHNOLOGIES INC·Filed 1994·Granted Aug 20, 1996·117 cites·46 claims
- 1388US5418855AAuthentication system and methodANGSTROM TECHNOLOGIES INC·Filed 1993·Granted May 23, 1995·125 cites·27 claims
- 1487US5666417AFluorescence authentication reader with coaxial opticsANGSTROM TECHNOLOGIES INC·Filed 1996·Granted Sep 9, 1997·107 cites·9 claims
- 1585US5574790AFluorescence authentication reader with coaxial opticsANGSTROM TECHNOLOGIES INC·Filed 1995·Granted Nov 12, 1996·88 cites·34 claims
- 1683US5387554AApparatus and method for thermally coupling a heat sink to a lead frameVLSI TECHNOLOGY INC·Filed 1993·Granted Feb 7, 1995·59 cites·5 claims
- 1783US5350713ADesign and sealing method for semiconductor packagesVLSI TECHNOLOGY INC·Filed 1992·Granted Sep 27, 1994·73 cites·20 claims
- 1882US6603871B2First-order authentication systemANGSTROM TECHNOLOGIES INC·Filed 2001·Granted Aug 5, 2003·41 cites·23 claims
- 1982US5420758AIntegrated circuit package using a multi-layer PCB in a plastic packageVLSI TECHNOLOGY INC·Filed 1994·Granted May 30, 1995·71 cites·3 claims
- 2081US5365409AIntegrated circuit package design having an intermediate die-attach substrate bonded to a leadframeVLSI TECHNOLOGY INC·Filed 1993·Granted Nov 15, 1994·73 cites·8 claims
- 2180US5386141ALeadframe having one or more power/ground planes without viasVLSI TECHNOLOGY INC·Filed 1992·Granted Jan 31, 1995·67 cites·18 claims
- 2279US6470093B2First-order authentication systemANGSTROM TECHNOLOGIES INC·Filed 2001·Granted Oct 22, 2002·34 cites·44 claims
- 2376US5359227ALead frame assembly and method for wiring sameVLSI TECHNOLOGY INC·Filed 1993·Granted Oct 25, 1994·47 cites·14 claims
- 2475US5171712AMethod of constructing termination electrodes on yielded semiconductor die by visibly aligning the die pads through a transparent substrateVLSI TECHNOLOGY INC·Filed 1991·Granted Dec 15, 1992·40 cites·16 claims
- 2564US5233131AIntegrated circuit die-to-leadframe interconnect assembly systemVLSI TECHNOLOGY INC·Filed 1991·Granted Aug 3, 1993·35 cites·23 claims
- 2658US5296744ALead frame assembly and method for wiring sameVLSI TECHNOLOGY INC·Filed 1992·Granted Mar 22, 1994·23 cites·4 claims
- 2751US5218215ASemiconductor device package having a thermal dissipation means that allows for lateral movement of the lead frame with respect to the housing without breakage of the thermal dissipation pathVLSI TECHNOLOGY INC·Filed 1990·Granted Jun 8, 1993·19 cites·13 claims
- 2839US2003080193A1Portable authentication fluorescence scanner employing single and multiple illumination sourcesFiled 2001·Application pending·0 cites
- 2933USD453175SMoney checkerANGSTROM TECHNOLOGIES INC·Filed 2001·Granted Jan 29, 2002·1 cites·1 claims
- 3030US6057177AReinforced leadframe to substrate attachmentVLSI TECHNOLOGY INC·Filed 1998·Granted May 2, 2000·0 cites·9 claims
- 3130US5905300AReinforced leadframe to substrate attachmentVLSI TECHNOLOGY INC·Filed 1997·Granted May 18, 1999·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →