Inventor · disambiguated record
Logan Myers
Also filed as: MYERS LOGAN
0 granted patents·3 pending applications·0 citations·filing 2023–2024
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0153US2025106997A1Electroless seed layer deposition on glass core substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 0253US2025014954A1Hybrid cores including adhesive promotion layers and related methodsAGARWAL SOHAM·Filed 2024·Application pending·0 cites
- 0351US2025183182A1Microelectronic assemblies with through-glass via stress alleviation in glass coresSHAN BOHAN·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →