Inventor · disambiguated record
Long Nguyen
Also filed as: NGUYEN LONG · NGUYEN LONG KHAC
20 granted patents·1 pending application·521 citations·filing 1998–2015
96Inventor score
Files withADVANCED TECH MATERIALS18ADVANCED TECHNOLOGIES MATERIAL1NGUYEN LONG KHAC1WOJTCZAK WILLIAM A1
Top patents by PatentIndex Score
21 records- 0195US6896826B2Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrateADVANCED TECH MATERIALS·Filed 2001·Granted May 24, 2005·74 cites·49 claims
- 0294US6409781B1Polishing slurries for copper and associated materialsADVANCED TECH MATERIALS·Filed 2000·Granted Jun 25, 2002·71 cites·42 claims
- 0391US6344432B1Formulations including a 1,3-dicarbonyl compound chelating agent and copper corrosion inhibiting agents for stripping residues from semiconductor substrates containing copper structuresADVANCED TECH MATERIALS·Filed 2000·Granted Feb 5, 2002·51 cites·14 claims
- 0490US6755989B2Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrateADVANCED TECH MATERIALS·Filed 2001·Granted Jun 29, 2004·43 cites·12 claims
- 0589US9452511B2Combination ER wrenchNGUYEN LONG KHAC·Filed 2010·Granted Sep 27, 2016·17 cites·8 claims
- 0689US7605113B2Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrateADVANCED TECH MATERIALS·Filed 2005·Granted Oct 20, 2009·11 cites·22 claims
- 0786US6566315B2Formulations including a 1,3-dicarbonyl compound chelating agent and copper corrosion inhibiting agents for stripping residues from semiconductor substrates containing copper structuresADVANCED TECH MATERIALS·Filed 2001·Granted May 20, 2003·50 cites·28 claims
- 0885US6527819B2Polishing slurries for copper and associated materialsADVANCED TECH MATERIALS·Filed 2001·Granted Mar 4, 2003·24 cites·40 claims
- 0985US6280651B1Selective silicon oxide etchant formulation including fluoride salt, chelating agent, and glycol solventADVANCED TECH MATERIALS·Filed 1998·Granted Aug 28, 2001·69 cites·13 claims
- 1082US6383410B1Selective silicon oxide etchant formulation including fluoride salt, chelating agent, and glycol solventADVANCED TECH MATERIALS·Filed 2001·Granted May 7, 2002·24 cites·13 claims
- 1178US6967169B2Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrateADVANCED TECH MATERIALS·Filed 2004·Granted Nov 22, 2005·16 cites·13 claims
- 1276US7662762B2Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substratesADVANCED TECH MATERIALS·Filed 2005·Granted Feb 16, 2010·4 cites·20 claims
- 1376US6306807B1Boric acid containing compositions for stripping residues from semiconductor substratesADVANCED TECH MATERIALS·Filed 1999·Granted Oct 23, 2001·38 cites·7 claims
- 1469US6936542B2Polishing slurries for copper and associated materialsADVANCED TECH MATERIALS·Filed 2001·Granted Aug 30, 2005·9 cites·45 claims
- 1563US6660700B2Formulations including a 1,3-dicarbonyl compound chelating agent and copper corrosion inhibiting agents for stripping residues from semiconductor substrates containing copper structuresADVANCED TECHNOLOGIES MATERIAL·Filed 2001·Granted Dec 9, 2003·10 cites·14 claims
- 1661US6492310B2Boric acid containing compositions for stripping residues from semiconductor substratesADVANCED TECH MATERIALS·Filed 2001·Granted Dec 10, 2002·6 cites·18 claims
- 1760US7427567B2Polishing slurries for copper and associated materialsADVANCED TECH MATERIALS·Filed 2005·Granted Sep 23, 2008·1 cites·21 claims
- 1856US9109188B2Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrateADVANCED TECH MATERIALS·Filed 2012·Granted Aug 18, 2015·0 cites·13 claims
- 1956US8293694B2Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrateWOJTCZAK WILLIAM A·Filed 2009·Granted Oct 23, 2012·1 cites·19 claims
- 2055US2015344826A1Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrateADVANCED TECH MATERIALS·Filed 2015·Application pending·0 cites
- 2151US6599870B2Boric acid containing compositions for stripping residues from semiconductor substratesADVANCED TECH MATERIALS·Filed 2002·Granted Jul 29, 2003·2 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →