Inventor · disambiguated record
Low Tek Beng
Also filed as: TEK BENG LOW
0 granted patents·2 pending applications·0 citations·filing 2024–2024
Technology areasH10W
Files withDOMINANT OPTO TECH SDN BHD2
Top patents by PatentIndex Score
2 records- 0157US2025331342A1Enhanced bond pad configuration for a light emitting diode (led) chip of a surface mountable package utilizing a gold ball that has been applied to a metal layer of the led chipDOMINANT OPTO TECH SDN BHD·Filed 2024·Application pending·0 cites
- 0255US2025212573A1Enhanced wire bond configuration for a light emitting diode packageDOMINANT OPTO TECH SDN BHD·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →