Inventor · disambiguated record
Long-Ching Wang
Also filed as: WANG LONG · WANG LONG-CHING
48 granted patents·20 pending applications·103 citations·filing 1990–2025
97Inventor score
Files withALPHA & OMEGA SEMICONDUCTOR INT LP24ALPHA & OMEGA SEMICONDUCTOR CAYMAN LTD10MARVELL WORLD TRADE LTD5INTEL CORP3WANG LONG3
Top patents by PatentIndex Score
68 records- 0188US11101137B1Method of making reverse conducting insulated gate bipolar transistorALPHA & OMEGA SEMICONDUCTOR INT LP·Filed 2020·Granted Aug 24, 2021·2 cites·15 claims
- 0288US10630080B1Super-fast transient response (STR) AC/DC Converter for high power density charging applicationALPHA & OMEGA SEMICONDUCTOR CAYMAN LTD·Filed 2019·Granted Apr 21, 2020·5 cites·20 claims
- 0382US9659851B2Method and apparatus for improving the reliability of a connection to a via in a substrateMARVELL WORLD TRADE LTD·Filed 2015·Granted May 23, 2017·4 cites·14 claims
- 0480US8846538B1Passive elements, articles, packages, semiconductor composites, and methods of manufacturing sameCHEN BOMY·Filed 2012·Granted Sep 30, 2014·7 cites·46 claims
- 0580US8098614B1Channel-occupancy efficient, low power wireless networkingWANG LONG·Filed 2007·Granted Jan 17, 2012·8 cites·2 claims
- 0678US7605092B2Passive elements, articles, packages, semiconductor composites, and methods of manufacturing sameSILICON STORAGE TECH INC·Filed 2007·Granted Oct 20, 2009·6 cites·54 claims
- 0777US9444510B2Method and apparatus for incorporating passive devices in an integrated passive device separate from a dieMARVELL WORLD TRADE LTD·Filed 2015·Granted Sep 13, 2016·3 cites·20 claims
- 0876US10648975B2Single channel chemiluminescent micro-fluidic chip and detection method thereofNANJING LANSION BIOTECHNOLOGY CO LTD·Filed 2017·Granted May 12, 2020·4 cites·8 claims
- 0975US10818568B1Super-fast transient response (STR) AC/DC converter for high power density charging applicationALPHA & OMEGA SEMICONDUCTOR CAYMAN LTD·Filed 2019·Granted Oct 27, 2020·2 cites·18 claims
- 1075US9276755B2Channel occupancy efficient, low power wireless networkingQUALCOMM INC·Filed 2013·Granted Mar 1, 2016·2 cites·18 claims
- 1172US10717421B2Braking force distribution method and system of multiple train unitsCRRC ZHUZHOU INST CO LTD·Filed 2016·Granted Jul 21, 2020·2 cites·4 claims
- 1270US11721665B2Wafer level chip scale semiconductor packageALPHA & OMEGA SEMICONDUCTOR INT LP·Filed 2022·Granted Aug 8, 2023·0 cites·7 claims
- 1369US9882730B2Channel-occupancy efficient, low power wireless networkingQUALCOMM INC·Filed 2015·Granted Jan 30, 2018·1 cites·17 claims
- 1468US12261101B2Semiconductor package having wettable lead flanks and tie bars and method of making the sameALPHA & OMEGA SEMICONDUCTOR INT LP·Filed 2022·Granted Mar 25, 2025·0 cites·13 claims
- 1568US10991660B2Semiconductor package having high mechanical strengthALPHA & OMEGA SEMICONDUCTOR CAYMAN LTD·Filed 2017·Granted Apr 27, 2021·1 cites·19 claims
- 1666US11784141B2Semiconductor package having thin substrate and method of making the sameALPHA & OMEGA SEMICONDUCTOR INT LP·Filed 2022·Granted Oct 10, 2023·0 cites·18 claims
- 1766US2025183123A1Power module having interconnected base plate with molded metal and method of making the sameALPHA & OMEGA SEMICONDUCTOR INT LP·Filed 2025·Application pending·0 cites
- 1866US2025183132A1Semiconductor package having wettable lead flanks and tie bars and method of making the sameALPHA & OMEGA SEMICONDUCTOR INT LP·Filed 2025·Application pending·0 cites
- 1965US11430762B2Method for semi-wafer level packagingALPHA & OMEGA SEMICONDUCTOR INT LP·Filed 2020·Granted Aug 30, 2022·0 cites·17 claims
- 2064US12243808B2Chip scale package (CSP) semiconductor device having thin substrateALPHA & OMEGA SEMICONDUCTOR INT LP·Filed 2022·Granted Mar 4, 2025·0 cites·17 claims
- 2164US5045502APdIn ohmic contact to GaAsBELL COMMUNICATIONS RES·Filed 1990·Granted Sep 3, 1991·39 cites·14 claims
- 2264US2025174524A1Chip scale package (csp) semiconductor device having thin substrateALPHA & OMEGA SEMICONDUCTOR INT LP·Filed 2025·Application pending·0 cites
- 2362US2025357279A1Semiconductor package having two or more driver devices and method of making the sameALPHA & OMEGA SEMICONDUCTOR INT LP·Filed 2024·Application pending·0 cites
- 2461US8435837B2Panel based lead frame packaging method and deviceTSAI CHEN LUNG·Filed 2009·Granted May 7, 2013·5 cites·7 claims
- 2561US2025157894A1Battery protection package having co-packed transistors and integrated circuit and method of making the sameALPHA & OMEGA SEMICONDUCTOR INT LP·Filed 2024·Application pending·0 cites
- 2660US2025070049A1Semiconductor rigid chip-scale package and method of making the sameALPHA & OMEGA SEMICONDUCTOR INT LP·Filed 2024·Application pending·0 cites
- 2760US2025266333A1Semiconductor package having partially plated lead flank and method of making the sameALPHA & OMEGA SEMICONDUCTOR INT LP·Filed 2024·Application pending·0 cites
- 2859US11495548B2Semiconductor package having thin substrate and method of making the sameALPHA & OMEGA SEMICONDUCTOR INT LP·Filed 2020·Granted Nov 8, 2022·0 cites·18 claims
- 2959US11474131B2Removing perturbation signal from a serial data stream, and to measurement and/or protection apparatus including sameANALOG DEVICES INTERNATIONAL UNLIMITED CO·Filed 2019·Granted Oct 18, 2022·0 cites·20 claims
- 3059US2025070069A1Semiconductor package having high metal bumps and ultra-thin substrate and method of making the sameALPHA & OMEGA SEMICONDUCTOR INT LP·Filed 2024·Application pending·0 cites
- 3158US12426153B2Twisted differential compensation for routing high-speed signals near power delivery inductors and system miniaturizationINTEL CORP·Filed 2021·Granted Sep 23, 2025·0 cites·20 claims
- 3258US8258065B2Passive elements, articles, packages, semiconductor composites, and methods of manufacturing sameCHEN BOMY·Filed 2009·Granted Sep 4, 2012·1 cites·39 claims
- 3358US2025096081A1Semiconductor package having interposer and method of making the sameALPHA & OMEGA SEMICONDUCTOR INT LP·Filed 2023·Application pending·0 cites
- 3458US2025323108A1Semiconductor package having ultra-thin substrate and method of making the sameALPHA & OMEGA SEMICONDUCTOR INT LP·Filed 2024·Application pending·0 cites
- 3556US2021175155A1Power module having interconnected base plate with molded metal and method of making the sameALPHA & OMEGA SEMICONDUCTOR CAYMAN LTD·Filed 2019·Application pending·0 cites
- 3656US2025118638A1Apparatus having surface mount packages having co-packed field effect transistorsALPHA & OMEGA SEMICONDUCTOR INT LP·Filed 2023·Application pending·0 cites
- 3756US2025112132A1Semiconductor package having lead frame with slanted sectionsALPHA & OMEGA SEMICONDUCTOR INT LP·Filed 2023·Application pending·0 cites
- 3856US2024429140A1Semiconductor package having multiple redistribution layers and method of making the sameALPHA & OMEGA SEMICONDUCTOR INT LP·Filed 2023·Application pending·0 cites
- 3955US6407008B1Method of forming an oxide layerINTEGRATED DEVICE TECH·Filed 2000·Granted Jun 18, 2002·6 cites·21 claims
- 4055US2022223330A1Technologies for a low-noise-generating inductorWANG LONG·Filed 2022·Application pending·0 cites
- 4153US2024295521A1Electrochemical detection method based on screen-printed electrodeLANSION BIOTECHNOLOGY CO LTD·Filed 2022·Application pending·0 cites
- 4252US11699627B2DMOS FET chip scale package and method of making the sameALPHA & OMEGA SEMICONDUCTOR INT LP·Filed 2021·Granted Jul 11, 2023·0 cites·17 claims
- 4352US2023333041A1Electrochemical test base and apparatus for activated clotting time (act)LANSION BIOTECHNOLOGY CO LTD·Filed 2022·Application pending·0 cites
- 4452US2024077924A1Power regulation circuit for droop mitigation in a power source voltage that powers a processing coreINTEL CORP·Filed 2022·Application pending·0 cites
- 4550US11222858B1Semiconductor package having enlarged gate pad and method of making the sameALPHA & OMEGA SEMICONDUCTOR INT LP·Filed 2020·Granted Jan 11, 2022·0 cites·20 claims
- 4649US8582496B2Channel-occupancy efficient, low power wireless networkingWANG LONG·Filed 2011·Granted Nov 12, 2013·0 cites·6 claims
- 4747US12278175B2Platform power integrity design including package standard power integrity model and compact voltage regulator module modelINTEL CORP·Filed 2021·Granted Apr 15, 2025·0 cites·21 claims
- 4847US11107723B1Method of fabricating semiconductor deviceUNITED SEMICONDUCTOR XIAMEN CO LTD·Filed 2020·Granted Aug 31, 2021·0 cites·13 claims
- 4947US10431515B2Methods and apparatus for self-alignment of integrated circuit diesMARVELL WORLD TRADE LTD·Filed 2017·Granted Oct 1, 2019·0 cites·20 claims
- 5046US12296722B2Main circuit of traction system and control method therefor and rail vehicleZHUZHOU CRRC TIMES ELECTRIC CO LTD·Filed 2018·Granted May 13, 2025·0 cites·10 claims
Showing the top 50 of 68 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →