Inventor · disambiguated record
Lovell B. Wiggins
Also filed as: WIGGINS LOVELL B
6 granted patents·154 citations·filing 1990–2002
86Inventor score
Technology areasH10W
Files withIBM6
Top patents by PatentIndex Score
6 records- 0187US6596621B1Method of forming a lead-free tin-silver-copper based solder alloy on an electronic substrateIBM·Filed 2002·Granted Jul 22, 2003·61 cites·20 claims
- 0258US5135595AProcess for fabricating a low dielectric composite substrateIBM·Filed 1990·Granted Aug 4, 1992·24 cites·9 claims
- 0353US5139851ALow dielectric composite substrateIBM·Filed 1990·Granted Aug 18, 1992·22 cites·19 claims
- 0451US5277725AProcess for fabricating a low dielectric composite substrateIBM·Filed 1992·Granted Jan 11, 1994·17 cites·15 claims
- 0549US5215610AMethod for fabricating superconductor packagesIBM·Filed 1991·Granted Jun 1, 1993·18 cites·4 claims
- 0644US5950073ASelf-adjusting semiconductor package stand-offsIBM·Filed 1997·Granted Sep 7, 1999·12 cites·34 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →