Inventor · disambiguated record
Lung-Kai Mao
Also filed as: MAO LUNG-KAI
11 granted patents·5 pending applications·9 citations·filing 2012–2024
83Inventor score
Top patents by PatentIndex Score
16 records- 0196US11854835B2Heterogeneous bonding structure and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·2 cites·20 claims
- 0289US11120997B2Surface treatment for etch tuningTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 14, 2021·6 cites·20 claims
- 0384US12438048B2Redistribution lines with protection layers and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Oct 7, 2025·0 cites·20 claims
- 0483US12494379B2Heterogeneous bonding structure and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 9, 2025·0 cites·20 claims
- 0581US11387143B2Redistribution lines with protection layers and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 12, 2022·1 cites·20 claims
- 0680US12009256B2Redistribution lines with protection layers and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 11, 2024·0 cites·20 claims
- 0779US12209013B2Arched membrane structure for MEMS deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 28, 2025·0 cites·20 claims
- 0877US11721579B2Redistribution lines with protection layers and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 8, 2023·0 cites·20 claims
- 0977US2024383744A1Arched membrane structure for mems deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1073US11894241B2Heterogeneous bonding structure and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 6, 2024·0 cites·20 claims
- 1170US2024153849A1Semiconductor device structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1269US12134557B2Arched membrane structure for MEMS deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 5, 2024·0 cites·20 claims
- 1364US11901266B2Semiconductor device structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 13, 2024·0 cites·20 claims
- 1454US2024120207A1Semiconductor packages and methods of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1538US2013181191A1Electronic devices including bio-polymeric material and method for manufacturing the sameHWANG JENN-CHANG·Filed 2012·Application pending·0 cites
- 1637US2013105204A1Circuit board and method for manufacturing the sameHWANG JENN-CHANG·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →