Inventor · disambiguated record
Ludovic Michel
Also filed as: MICHEL LUDOVIC · MICHEL LUDOVIC LOUIS
4 granted patents·28 citations·filing 1993–2015
68Inventor score
Top patents by PatentIndex Score
4 records- 0150US5438020AProcess for flip-chip bonding a semiconductor chip using wire leadsTHOMSON CSF·Filed 1993·Granted Aug 1, 1995·23 cites·3 claims
- 0241US10920383B2Cable anchorage systemVSL INT AG·Filed 2015·Granted Feb 16, 2021·0 cites·14 claims
- 0327US6560121B1Method for surface mounting of a microwave package on a printed circuit and package and printed circuit for implementing said methodTHOMSON CSF·Filed 1998·Granted May 6, 2003·5 cites·8 claims
- 0425US6454171B1Electronic card encapsulating at least one IC chip and the method for producing the sameTHOMSON CSF·Filed 1998·Granted Sep 24, 2002·0 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →