Inventor · disambiguated record
Luu Thanh Nguyen
Also filed as: NGUYEN LUU · NGUYEN LUU T · NGUYEN LUU THANH
64 granted patents·10 pending applications·2,119 citations·filing 1988–2021
99Inventor score
Top patents by PatentIndex Score
74 records- 0199US5422435AStacked multi-chip modules and method of manufacturingNAT SEMICONDUCTOR CORP·Filed 1992·Granted Jun 6, 1995·513 cites·40 claims
- 0298US6384397B1Low cost die sized module for imaging application having a lens housing assemblyNAT SEMICONDUCTOR CORP·Filed 2000·Granted May 7, 2002·215 cites·17 claims
- 0394US6238949B1Method and apparatus for forming a plastic chip on chip package moduleNAT SEMICONDUCTOR CORP·Filed 1999·Granted May 29, 2001·156 cites·15 claims
- 0493US9663357B2Open cavity package using chip-embedding technologyTEXAS INSTRUMENTS INC·Filed 2015·Granted May 30, 2017·12 cites·20 claims
- 0593US6707140B1Arrayable, scaleable, and stackable molded package configurationNAT SEMICONDUCTOR CORP·Filed 2000·Granted Mar 16, 2004·87 cites·28 claims
- 0692US4934309ASolder deposition systemIBM·Filed 1989·Granted Jun 19, 1990·67 cites·14 claims
- 0791US7651891B1Integrated circuit package with stress reductionNAT SEMICONDUCTOR CORP·Filed 2007·Granted Jan 26, 2010·23 cites·13 claims
- 0891US6245595B1Techniques for wafer level molding of underfill encapsulantNAT SEMICONDUCTOR CORP·Filed 1999·Granted Jun 12, 2001·161 cites·15 claims
- 0990US8716830B2Thermally efficient integrated circuit packagePODDAR ANINDYA·Filed 2011·Granted May 6, 2014·14 cites·11 claims
- 1090US7808089B2Leadframe having die attach pad with delamination and crack-arresting featuresNAT SEMICONDUCTOR CORP·Filed 2007·Granted Oct 5, 2010·30 cites·14 claims
- 1190US7703993B1Wafer level optoelectronic package with fiber side insertionNAT SEMICONDUCTOR CORP·Filed 2008·Granted Apr 27, 2010·26 cites·17 claims
- 1290US6364542B1Device and method for providing a true semiconductor die to external fiber optic cable connectionNAT SEMICONDUCTOR CORP·Filed 2000·Granted Apr 2, 2002·55 cites·25 claims
- 1390US5328079AMethod of and arrangement for bond wire connecting together certain integrated circuit componentsNAT SEMICONDUCTOR CORP·Filed 1993·Granted Jul 12, 1994·148 cites·9 claims
- 1489US7098540B1Electrical interconnect with minimal parasitic capacitanceNAT SEMICONDUCTOR CORP·Filed 2003·Granted Aug 29, 2006·67 cites·16 claims
- 1588US6624507B1Miniature semiconductor package for opto-electronic devicesNAT SEMICONDUCTOR CORP·Filed 2001·Granted Sep 23, 2003·50 cites·19 claims
- 1685US11031311B2Packaged semiconductor device with multilayer stress bufferTEXAS INSTRUMENTS INC·Filed 2018·Granted Jun 8, 2021·1 cites·25 claims
- 1785US7824963B2Inkjet printed leadframeNAT SEMICONDUCTOR CORP·Filed 2009·Granted Nov 2, 2010·9 cites·13 claims
- 1885US6802654B1Electrical connector for opto-electronic modulesNAT SEMICONDUCTOR CORP·Filed 2002·Granted Oct 12, 2004·33 cites·21 claims
- 1985US6595699B1Optoelectronic package with controlled fiber standoffNAT SEMICONDUCTOR CORP·Filed 2001·Granted Jul 22, 2003·40 cites·25 claims
- 2084US10541220B1Printed repassivation for wafer chip scale packagingTEXAS INSTRUMENTS INC·Filed 2018·Granted Jan 21, 2020·4 cites·26 claims
- 2184US6749345B1Apparatus and method for electro-optical packages that facilitate the coupling of optical cables to printed circuit boardsNAT SEMICONDUCTOR CORP·Filed 2002·Granted Jun 15, 2004·28 cites·30 claims
- 2284US6352881B1Method and apparatus for forming an underfill adhesive layerNAT SEMICONDUCTOR CORP·Filed 1999·Granted Mar 5, 2002·70 cites·8 claims
- 2383US7253078B1Method and apparatus for forming an underfill adhesive layerNAT SEMICONDUCTOR CORP·Filed 2002·Granted Aug 7, 2007·31 cites·32 claims
- 2482US6655854B1Optoelectronic package with dam structure to provide fiber standoffNAT SEMICONDUCTOR CORP·Filed 2001·Granted Dec 2, 2003·31 cites·34 claims
- 2581US7728399B2Molded optical package with fiber coupling featureNAT SEMICONDUCTOR CORP·Filed 2008·Granted Jun 1, 2010·11 cites·24 claims
- 2678US6642613B1Techniques for joining an opto-electronic module to a semiconductor packageNAT SEMICONDUCTOR CORP·Filed 2001·Granted Nov 4, 2003·13 cites·22 claims
- 2778US4898117ASolder deposition systemIBM·Filed 1988·Granted Feb 6, 1990·36 cites·10 claims
- 2877US10516381B23D-printed protective shell structures for stress sensitive circuitsTEXAS INSTRUMENTS INC·Filed 2017·Granted Dec 24, 2019·2 cites·19 claims
- 2976US11021786B2Copper passivationTEXAS INSTRUMENTS INC·Filed 2018·Granted Jun 1, 2021·2 cites·38 claims
- 3076US10763231B2Bump bond structure for enhanced electromigration performanceTEXAS INSTRUMENTS INC·Filed 2018·Granted Sep 1, 2020·2 cites·12 claims
- 3174US6830382B1Miniature form-factor connecter for fiber optic modulesNAT SEMICONDUCTOR CORP·Filed 2002·Granted Dec 14, 2004·15 cites·19 claims
- 3273US7086788B2Optical sub-assembly for opto-electronic modulesNAT SEMICONDUCTOR CORP·Filed 2005·Granted Aug 8, 2006·5 cites·18 claims
- 3372US6822315B2Apparatus and method for scribing semiconductor wafers using vision recognitionNAT SEMICONDUCTOR CORP·Filed 2002·Granted Nov 23, 2004·14 cites·14 claims
- 3471US6863450B2Optical sub-assembly packaging techniques that incorporate optical lensesNAT SEMICONDUCTOR CORP·Filed 2002·Granted Mar 8, 2005·11 cites·9 claims
- 3571US2021351098A1Packaged Semiconductor Device With Multilayer Stress BufferTEXAS INSTRUMENTS INC·Filed 2021·Application pending·0 cites
- 3670US10763230B2Integrated circuit backside metallizationTEXAS INSTRUMENTS INC·Filed 2018·Granted Sep 1, 2020·1 cites·8 claims
- 3769US10077186B2Integrated circuit package with sensor and method of makingTEXAS INSTRUMENTS INC·Filed 2017·Granted Sep 18, 2018·1 cites·19 claims
- 3868US12449620B2Structure and method to remove semiconductor chip material for optical signal access to a photonic chipPSIQUANTUM CORP·Filed 2021·Granted Oct 21, 2025·0 cites·28 claims
- 3967US6628000B1Techniques for maintaining parallelism between optical and chip sub-assembliesNAT SEMICONDUCTOR CORP·Filed 2001·Granted Sep 30, 2003·10 cites·29 claims
- 4067US5049201AMethod of inhibiting corrosion in an electronic packageIBM·Filed 1989·Granted Sep 17, 1991·32 cites·20 claims
- 4165US11367699B2Integrated circuit backside metallizationTEXAS INSTRUMENTS INC·Filed 2020·Granted Jun 21, 2022·0 cites·19 claims
- 4265US9688530B2Integrated circuit package with sensor and method of makingTEXAS INSTRUMENTS INC·Filed 2015·Granted Jun 27, 2017·1 cites·12 claims
- 4365US6916121B2Optical sub-assembly for optoelectronic modulesNAT SEMICONDUCTOR CORP·Filed 2002·Granted Jul 12, 2005·11 cites·32 claims
- 4464US10650957B1Additive deposition low temperature curable magnetic interconnecting layer for power components integrationTEXAS INSTRUMENTS INC·Filed 2018·Granted May 12, 2020·0 cites·23 claims
- 4564US7195955B2Technique for protecting photonic devices in optoelectronic packages with clear overmoldingNAT SEMICONDUCTOR CORP·Filed 2005·Granted Mar 27, 2007·2 cites·6 claims
- 4662US11450638B2Bump bond structure for enhanced electromigration performanceTEXAS INSTRUMENTS INC·Filed 2020·Granted Sep 20, 2022·0 cites·15 claims
- 4761US7247942B2Techniques for joining an opto-electronic module to a semiconductor packageNAT SEMICONDUCTOR CORP·Filed 2004·Granted Jul 24, 2007·5 cites·20 claims
- 4860US11082028B23D-printed protective shell structures with support columns for stress sensitive circuitsTEXAS INSTRUMENTS INC·Filed 2019·Granted Aug 3, 2021·0 cites·19 claims
- 4960US7073961B2Optical sub-assembly packaging techniques that incorporate optical lensesNAT SEMICONDUCTOR CORP·Filed 2005·Granted Jul 11, 2006·2 cites·17 claims
- 5058US6858468B2Techniques for joining an opto-electronic module to a semiconductor packageNAT SEMICONDUCTOR CORP·Filed 2003·Granted Feb 22, 2005·4 cites·14 claims
Showing the top 50 of 74 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →