Inventor · disambiguated record
Luay Kuan Ong
Also filed as: ONG LUAY KUAN
0 granted patents·2 pending applications·0 citations·filing 2023–2024
Technology areasH10W
Files withINFINEON TECHNOLOGIES AG2
Top patents by PatentIndex Score
2 records- 0159US2025226297A1Package with carrier having plated bottom surface and sidewallINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 0251US2024006260A1Encapsulated package with exposed electrically conductive structures and sidewall recessINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →