Inventor · disambiguated record
Luc Ouellet
Also filed as: OUELLET LUC · OUELLET LUC L
3 granted patents·2 pending applications·96 citations·filing 1997–2013
76Inventor score
Top patents by PatentIndex Score
5 records- 0184US6074895AMethod of forming a flip chip assemblyIBM·Filed 1997·Granted Jun 13, 2000·63 cites·14 claims
- 0266US6306683B1Method of forming a flip chip assembly, and a flip chip assembly formed by the methodIBM·Filed 2000·Granted Oct 23, 2001·16 cites·42 claims
- 0358US6348738B1Flip chip assemblyIBM·Filed 1999·Granted Feb 19, 2002·17 cites·7 claims
- 0448US2013161822A1Controlling density of particles within underfill surrounding solder bump contactsIBM·Filed 2013·Application pending·0 cites
- 0543US2012168956A1Controlling density of particles within underfill surrounding solder bump contactsBARBEAU STEPHANE S·Filed 2011·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Luc Ouellet files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →