Inventor · disambiguated record
Luis E. Zapata
Also filed as: ZAPATA LUIS · ZAPATA LUIS E
10 granted patents·1 pending application·260 citations·filing 1977–2017
91Inventor score
Files withUNIV CALIFORNIA5DEUTSCHES ELEKTRONEN SYNCHROTRON DESY1MASSACHUSETTS INST TECHNOLOGY1REMACHES IND S A1US ARMY1
Top patents by PatentIndex Score
11 records- 0187US5335237AParasitic oscillation suppression in solid state lasers using absorbing thin filmsUS ARMY·Filed 1992·Granted Aug 2, 1994·57 cites·15 claims
- 0285US6834070B2Edge-facet pumped, multi-aperture, thin-disk laser geometry for very high average power output scalingUNIV CALIFORNIA·Filed 2001·Granted Dec 21, 2004·24 cites·47 claims
- 0383US6763050B2Method for optical pumping of thin laser media at high average powerUNIV CALIFORNIA·Filed 2001·Granted Jul 13, 2004·20 cites·32 claims
- 0481US5978407ACompact and highly efficient laser pump cavityUS ENRICHMENT CORP·Filed 1997·Granted Nov 2, 1999·61 cites·26 claims
- 0578US5285310AHigh power regenerative laser amplifierUNIV CALIFORNIA·Filed 1992·Granted Feb 8, 1994·39 cites·21 claims
- 0677US9065241B2Methods, systems, and apparatus for high energy optical-pulse amplification at high average powerZAPATA LUIS E·Filed 2013·Granted Jun 23, 2015·7 cites·45 claims
- 0769US10095083B2Method and apparatus for generating THz radiationDEUTSCHES ELEKTRONEN SYNCHROTRON DESY·Filed 2017·Granted Oct 9, 2018·1 cites·19 claims
- 0868US5971565ALamp system with conditioned water coolant and diffuse reflector of polytetrafluorethylene(PTFE)UNIV CALIFORNIA·Filed 1995·Granted Oct 26, 1999·28 cites·20 claims
- 0946US6252203B1Lamp system for uniform semiconductor wafer heatingUNIV CALIFORNIA·Filed 1999·Granted Jun 26, 2001·11 cites·22 claims
- 1042US4136417AMethod and machine for forming a hollow rivetREMACHES IND S A·Filed 1977·Granted Jan 30, 1979·12 cites·14 claims
- 1133US2015285749A1Compact X-Ray Source for CD-SAXSMASSACHUSETTS INST TECHNOLOGY·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →