Inventor · disambiguated record
Lyle Breiner
Also filed as: BREINER LYLE · BREINER LYLE D
34 granted patents·10 pending applications·1,475 citations·filing 1993–2013
98Inventor score
Top patents by PatentIndex Score
44 records- 0199US7422635B2Methods and apparatus for processing microfeature workpieces, e.g., for depositing materials on microfeature workpiecesMICRON TECHNOLOGY INC·Filed 2003·Granted Sep 9, 2008·483 cites·17 claims
- 0298US6551893B1Atomic layer deposition of capacitor dielectricMICRON TECHNOLOGY INC·Filed 2001·Granted Apr 22, 2003·172 cites·21 claims
- 0393US6526547B2Method for efficient manufacturing of integrated circuitsMICRON TECHNOLOGY INC·Filed 2001·Granted Feb 25, 2003·66 cites·23 claims
- 0493US6298470B1Method for efficient manufacturing of integrated circuitsMICRON TECHNOLOGY INC·Filed 1999·Granted Oct 2, 2001·133 cites·21 claims
- 0593US5656531AMethod to form hemi-spherical grain (HSG) silicon from amorphous siliconMICRON TECHNOLOGY INC·Filed 1995·Granted Aug 12, 1997·119 cites·47 claims
- 0692US7647886B2Systems for depositing material onto workpieces in reaction chambers and methods for removing byproducts from reaction chambersMICRON TECHNOLOGY INC·Filed 2003·Granted Jan 19, 2010·45 cites·8 claims
- 0792US5837580AMethod to form hemi-spherical grain (HSG) siliconMICRON TECHNOLOGY INC·Filed 1997·Granted Nov 17, 1998·105 cites·8 claims
- 0890US6458714B1Method of selective oxidation in semiconductor manufactureMICRON TECHNOLOGY INC·Filed 2000·Granted Oct 1, 2002·53 cites·53 claims
- 0988US6388284B2Capacitor structuresMICRON TECHNOLOGY INC·Filed 2001·Granted May 14, 2002·44 cites·29 claims
- 1086US7771537B2Methods and systems for controlling temperature during microfeature workpiece processing, E.G. CVD depositionMICRON TECHNOLOGY INC·Filed 2006·Granted Aug 10, 2010·5 cites·13 claims
- 1186US7279398B2Microfeature workpiece processing apparatus and methods for controlling deposition of materials on microfeature workpiecesMICRON TECHNOLOGY INC·Filed 2006·Granted Oct 9, 2007·6 cites·12 claims
- 1285US7056806B2Microfeature workpiece processing apparatus and methods for controlling deposition of materials on microfeature workpiecesMICRON TECHNOLOGY INC·Filed 2003·Granted Jun 6, 2006·23 cites·31 claims
- 1381US7112544B2Method of atomic layer deposition on plural semiconductor substrates simultaneouslyMICRON TECHNOLOGY INC·Filed 2004·Granted Sep 26, 2006·16 cites·16 claims
- 1480US6835674B2Methods for treating pluralities of discrete semiconductor substratesMICRON TECHNOLOGY INC·Filed 2004·Granted Dec 28, 2004·15 cites·20 claims
- 1579US7258892B2Methods and systems for controlling temperature during microfeature workpiece processing, e.g., CVD depositionMICRON TECHNOLOGY INC·Filed 2003·Granted Aug 21, 2007·13 cites·27 claims
- 1678US7440255B2Capacitor constructions and methods of formingMICRON TECHNOLOGY INC·Filed 2003·Granted Oct 21, 2008·20 cites·56 claims
- 1778US7235138B2Microfeature workpiece processing apparatus and methods for batch deposition of materials on microfeature workpiecesMICRON TECHNOLOGY INC·Filed 2003·Granted Jun 26, 2007·14 cites·20 claims
- 1875US6291289B2Method of forming DRAM trench capacitor with metal layer over hemispherical grain polysiliconMICRON TECHNOLOGY INC·Filed 1999·Granted Sep 18, 2001·41 cites·13 claims
- 1974US8384192B2Methods for forming small-scale capacitor structuresMICRON TECHNOLOGY INC·Filed 2011·Granted Feb 26, 2013·2 cites·22 claims
- 2073US6121081AMethod to form hemi-spherical grain (HSG) siliconMICRON TECHNOLOGY INC·Filed 1998·Granted Sep 19, 2000·31 cites·6 claims
- 2171US7344755B2Methods and apparatus for processing microfeature workpieces; methods for conditioning ALD reaction chambersMICRON TECHNOLOGY INC·Filed 2003·Granted Mar 18, 2008·10 cites·12 claims
- 2268US7220312B2Methods for treating semiconductor substratesMICRON TECHNOLOGY INC·Filed 2002·Granted May 22, 2007·7 cites·20 claims
- 2368US7183208B2Methods for treating pluralities of discrete semiconductor substratesMICRON TECHNOLOGY INC·Filed 2003·Granted Feb 27, 2007·7 cites·39 claims
- 2467US7906393B2Methods for forming small-scale capacitor structuresMICRON TECHNOLOGY INC·Filed 2004·Granted Mar 15, 2011·8 cites·44 claims
- 2566US7528430B2Electronic systemsMICRON TECHNOLOGY INC·Filed 2006·Granted May 5, 2009·2 cites·12 claims
- 2661US6881636B2Methods of forming deuterated silicon nitride-containing materialsMICRON TECHNOLOGY INC·Filed 2003·Granted Apr 19, 2005·7 cites·12 claims
- 2761US2006205187A1Methods and apparatus for processing microfeature workpieces, e.g., for depositing materials on microfeature workpiecesMICRON TECHNOLOGY INC·Filed 2006·Application pending·0 cites
- 2861US2006213440A1Methods and apparatus for processing microfeature workpieces, e.g., for depositing materials on microfeature workpiecesMICRON TECHNOLOGY INC·Filed 2006·Application pending·0 cites
- 2959US5880036AMethod for enhancing oxide to nitride selectivity through the use of independent heat controlMICRON TECHNOLOGY INC·Filed 1993·Granted Mar 9, 1999·19 cites·32 claims
- 3059US2006198955A1Microfeature workpiece processing apparatus and methods for batch deposition of materials on microfeature workpiecesMICRON TECHNOLOGY INC·Filed 2006·Application pending·0 cites
- 3156US8518184B2Methods and systems for controlling temperature during microfeature workpiece processing, E.G., CVD depositionBEAMAN KEVIN L·Filed 2010·Granted Aug 27, 2013·0 cites·22 claims
- 3256US7321148B2Capacitor constructions and rugged silicon-containing surfacesMICRON TECHNOLOGY INC·Filed 2004·Granted Jan 22, 2008·4 cites·5 claims
- 3353US7247581B2Methods for treating pluralities of discrete semiconductor substratesMICRON TECHNOLOGY INC·Filed 2005·Granted Jul 24, 2007·0 cites·8 claims
- 3453US2013166057A1Methods for forming small-scale capacitor structuresMICRON TECHNOLOGY INC·Filed 2013·Application pending·0 cites
- 3552US6916723B2Methods of forming rugged semiconductor-containing surfacesMICRON TECHNOLOGY INC·Filed 2003·Granted Jul 12, 2005·3 cites·45 claims
- 3650US7268382B2DRAM cellsMICRON TECHNOLOGY INC·Filed 2006·Granted Sep 11, 2007·0 cites·7 claims
- 3748US6887755B2Methods of forming rugged silicon-containing surfacesMICRON TECHNOLOGY INC·Filed 2003·Granted May 3, 2005·1 cites·30 claims
- 3846US2006196538A1Systems for depositing material onto workpieces in reaction chambers and methods for removing byproducts from reaction chambersMICRON TECHNOLOGY INC·Filed 2006·Application pending·0 cites
- 3946US2005009335A1Apparatuses for treating pluralities of discrete semiconductor substrates; and methods for treating pluralities of discrete semiconductor substratesFiled 2004·Application pending·0 cites
- 4045US7405438B2Capacitor constructions and semiconductor structuresMICRON TECHNOLOGY INC·Filed 2004·Granted Jul 29, 2008·1 cites·6 claims
- 4144US2004166647A1Atomic layer deposition of capacitor dielectricFiled 2004·Application pending·0 cites
- 4243US2005269669A1Capacitor constructions and methods of formingMCCLURE BRENT A·Filed 2005·Application pending·0 cites
- 4343US2003166318A1Atomic layer deposition of capacitor dielectricFiled 2003·Application pending·0 cites
- 4442US2003098480A1Atomic layer deposition of capacitor dielectricFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →