Inventor · disambiguated record
Ly Do
Also filed as: DO LY · DO LY PHUOC
2 granted patents·1 pending application·1 citations·filing 2008–2018
30Inventor score
Top patents by PatentIndex Score
3 records- 0157US10913879B2Thermally conductive pre-applied underfill formulations and uses thereofHenkel IP & Holding GmbH·Filed 2016·Granted Feb 9, 2021·1 cites·20 claims
- 0235US2010000898A1Packaging assembly for printing platesBOHN JOHANNES·Filed 2008·Application pending·0 cites
- 0334US10927249B2Resin compositions for underfill film for three dimensional through silica via (TSV) packages and compositions useful for the preparation thereofHenkel IP & Holding GmbH·Filed 2018·Granted Feb 23, 2021·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →