Inventor · disambiguated record
Lynn Forester
Also filed as: FORESTER LYNN
8 granted patents·3 pending applications·416 citations·filing 1996–2007
90Inventor score
Files withALLIED SIGNAL INC4QUANTUM SEMICONDUCTOR LLC2AUGUSTO CARLOS J R P1HONEYWELL INT INC1J R P AUGUSTO CARLOS1
Top patents by PatentIndex Score
11 records- 0193US7265006B2Method of fabricating heterojunction devices integrated with CMOSQUANTUM SEMICONDUCTOR LLC·Filed 2005·Granted Sep 4, 2007·28 cites·26 claims
- 0292US6080526AIntegration of low-k polymers into interlevel dielectrics using controlled electron-beam radiationALLIED SIGNAL INC·Filed 1998·Granted Jun 27, 2000·154 cites·24 claims
- 0387US6943051B2Method of fabricating heterojunction photodiodes integrated with CMOSQUANTUM SEMICONDUCTOR LLC·Filed 2001·Granted Sep 13, 2005·52 cites·12 claims
- 0487US6042994ANanoporous silica dielectric films modified by electron beam exposure and having low dielectric constant and low water contentALLIED SIGNAL INC·Filed 1999·Granted Mar 28, 2000·91 cites·28 claims
- 0573US8816443B2Method of fabricating heterojunction photodiodes with CMOSAUGUSTO CARLOS J R P·Filed 2007·Granted Aug 26, 2014·6 cites·39 claims
- 0673US5952243ARemoval rate behavior of spin-on dielectrics with chemical mechanical polishALLIED SIGNAL INC·Filed 1996·Granted Sep 14, 1999·52 cites·18 claims
- 0764US6652922B1Electron-beam processed films for microelectronics structuresALLIED SIGNAL INC·Filed 1996·Granted Nov 25, 2003·25 cites·16 claims
- 0860US6656532B2Layered hard mask and dielectric materials and methods thereforHONEYWELL INT INC·Filed 2001·Granted Dec 2, 2003·8 cites·20 claims
- 0942US2004076764A1Electron-beam processed films for microelectronics structuresFiled 2003·Application pending·0 cites
- 1037US2004134608A1Layered hard mask and dielectric materials and method thereforFiled 2003·Application pending·0 cites
- 1136US2006014334A1Method of fabricating heterojunction devices integrated with CMOSJ R P AUGUSTO CARLOS·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →