Inventor · disambiguated record

M Vijendran

Also filed as: VIJENDRAN M

4 granted patents·5 citations·filing 2004–2007

67Inventor score

Technology areasH10W

Files withMICRON TECHNOLOGY INC4

Top patents by PatentIndex Score

4 records

0164US7354795B2Methods for packaging and encapsulating semiconductor device assemblies that include tape substratesMICRON TECHNOLOGY INC·Filed 2007·Granted Apr 8, 2008·2 cites·18 claims
0250US7057297B2Tape substrates with mold gate support structures that are coplanar with conductive traces thereof and associated methodsMICRON TECHNOLOGY INC·Filed 2004·Granted Jun 6, 2006·3 cites·28 claims
0346US7250687B2Systems for degating packaged semiconductor devices with tape substratesMICRON TECHNOLOGY INC·Filed 2005·Granted Jul 31, 2007·0 cites·20 claims
0446US7190081B2Mold gates and tape substrates including the mold gatesMICRON TECHNOLOGY INC·Filed 2005·Granted Mar 13, 2007·0 cites·19 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →