Inventor · disambiguated record
Masatoshi Akagawa
Also filed as: AKAGAWA MASATOSHI
28 granted patents·6 pending applications·1,718 citations·filing 1994–2011
97Inventor score
Top patents by PatentIndex Score
34 records- 0198US6590291B2Semiconductor device and manufacturing method thereforSHINKO ELECTRIC IND CO·Filed 2001·Granted Jul 8, 2003·197 cites·5 claims
- 0298US5834844ASemiconductor device having an element with circuit pattern thereonSHINKO ELECTRIC IND CO·Filed 1996·Granted Nov 10, 1998·525 cites·10 claims
- 0396US6121688AAnisotropic conductive sheet and printed circuit boardSHINKO ELECTRIC IND CO·Filed 1998·Granted Sep 19, 2000·107 cites·8 claims
- 0495US5918113AProcess for producing a semiconductor device using anisotropic conductive adhesiveSHINKO ELECTRIC IND CO·Filed 1997·Granted Jun 29, 1999·200 cites·14 claims
- 0594US5677576AChip sized semiconductor deviceSHINKO ELECTRIC IND CO·Filed 1996·Granted Oct 14, 1997·177 cites·12 claims
- 0691US6759268B2Semiconductor device and manufacturing method thereforSHINKO ELECTRIC IND CO·Filed 2002·Granted Jul 6, 2004·58 cites·18 claims
- 0791US5886415AAnisotropic conductive sheet and printed circuit boardSHINKO ELECTRIC IND CO·Filed 1997·Granted Mar 23, 1999·73 cites·17 claims
- 0889US6964887B2Method for manufacturing semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2003·Granted Nov 15, 2005·50 cites·13 claims
- 0989US5960308AProcess for making a chip sized semiconductor deviceSHINKO ELECTRIC IND CO·Filed 1998·Granted Sep 28, 1999·104 cites·11 claims
- 1081US7053475B2Semiconductor device and manufacturing method thereforSHINKO ELECTRIC IND CO·Filed 2001·Granted May 30, 2006·27 cites·3 claims
- 1181US6380614B1Non-contact type IC card and process for manufacturing sameSHINKO ELECTRIC IND CO·Filed 2000·Granted Apr 30, 2002·35 cites·9 claims
- 1276US7707713B2Component-embedded circuit board fabrication methodSHINKO ELECTRIC IND CO·Filed 2007·Granted May 4, 2010·6 cites·4 claims
- 1376US6255725B1IC card and plane coil for IC cardSHINKO ELECTRIC IND CO·Filed 2000·Granted Jul 3, 2001·24 cites·13 claims
- 1473US5404273ASemiconductor-device package and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 1994·Granted Apr 4, 1995·46 cites·7 claims
- 1572US6717249B2Non-contact type IC card and process for manufacturing-sameSHINKO ELECTRIC IND CO·Filed 2002·Granted Apr 6, 2004·15 cites·15 claims
- 1671US6469371B2Non-contact type IC card and process for manufacturing sameSHINKO ELECTRIC IND CO·Filed 2000·Granted Oct 22, 2002·15 cites·3 claims
- 1770US6552694B1Semiconductor device and fabrication method thereofSHINKO ELECTRIC IND CO·Filed 2000·Granted Apr 22, 2003·15 cites·20 claims
- 1866US7495745B2Patterning method and computer readable medium thereforSHINKO ELECTRIC IND CO·Filed 2007·Granted Feb 24, 2009·2 cites·10 claims
- 1966US7445965B2Method of manufacturing radiating plate and semiconductor apparatus using the sameSHINKO ELECTRIC IND CO·Filed 2005·Granted Nov 4, 2008·4 cites·2 claims
- 2061US6452806B2Frame for IC cardFiled 2001·Granted Sep 17, 2002·8 cites·15 claims
- 2158US7100279B2Method of mounting an electronic partROHM CO LTD·Filed 2004·Granted Sep 5, 2006·5 cites·1 claims
- 2253US7303243B2Pattern drawing apparatus and pattern drawing method for forming patterns, that have mirror image relationship to each other with respect to a substrate, on both sides of the substrate, and test apparatus for use in the pattern drawing apparatusSHINKO ELECTRIC IND CO·Filed 2004·Granted Dec 4, 2007·3 cites·18 claims
- 2352US2006253295A1Billing apparatus for direct drawing apparatusSEKIGAWA KAZUNARI·Filed 2006·Application pending·0 cites
- 2450US7890203B2Wiring forming system and wiring forming method for forming wiring on wiring boardSHINKO ELECTRIC IND CO·Filed 2003·Granted Feb 15, 2011·2 cites·31 claims
- 2550US7179584B2Exposure method and device for forming patterns on printed wiring boardSHINKO ELECTRIC IND CO·Filed 2002·Granted Feb 20, 2007·3 cites·9 claims
- 2650US6252777B1IC card and its frameSHINKO ELECTRIC IND CO·Filed 1999·Granted Jun 26, 2001·13 cites·29 claims
- 2750US2004175450A1Stereolithographic shaping method and apparatusFiled 2004·Application pending·0 cites
- 2849US7793412B2Component-embedded board fabrication methodSHINKO ELECTRIC IND CO·Filed 2003·Granted Sep 14, 2010·3 cites·32 claims
- 2947US2011106287A1Wiring forming system and wiring forming method for forming wiring on wiring boardSHINKO ELECTRIC IND CO·Filed 2011·Application pending·0 cites
- 3047US2002047229A1Stereolithographic shaping method and apparatusFiled 2001·Application pending·0 cites
- 3146US7307691B2Maskless direct exposure system and user interfaceSHINKO ELECTRIC IND CO·Filed 2004·Granted Dec 11, 2007·1 cites·22 claims
- 3243US2003057536A1Non-contact type IC cardSHINKO ELECTRIC IND CO·Filed 2002·Application pending·0 cites
- 3341US2002030255A1Non-contact type IC cardFiled 2000·Application pending·0 cites
- 3440US7442477B2Exposing apparatus and exposing method, for maskless exposure of substrate to be exposed, and plotter and plotting method for directly plotting on object to be plottedSHINKO ELECTRIC IND CO·Filed 2004·Granted Oct 28, 2008·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →