Inventor · disambiguated record
Masayuki Akou
Also filed as: AKOU MASAYUKI
13 granted patents·1 pending application·23 citations·filing 1990–2024
85Inventor score
Top patents by PatentIndex Score
14 records- 0186US10777501B2Semiconductor device and method of manufacturing the sameTOSHIBA MEMORY CORP·Filed 2018·Granted Sep 15, 2020·6 cites·15 claims
- 0271US9576881B2Semiconductor deviceTOSHIBA KK·Filed 2015·Granted Feb 21, 2017·2 cites·19 claims
- 0365US2024431101A1Semiconductor deviceKIOXIA CORP·Filed 2024·Application pending·0 cites
- 0463US9466373B2Nonvolatile semiconductor storage deviceTOSHIBA KK·Filed 2014·Granted Oct 11, 2016·1 cites·20 claims
- 0561US5082870AMethod of making an electrically conductive polyurethane foamBRIDGESTONE CORP·Filed 1990·Granted Jan 21, 1992·13 cites·3 claims
- 0657US11482489B2Semiconductor device and method of manufacturing the sameKIOXIA CORP·Filed 2020·Granted Oct 25, 2022·0 cites·5 claims
- 0757US10056315B2Semiconductor deviceTOSHIBA MEMORY CORP·Filed 2017·Granted Aug 21, 2018·1 cites·19 claims
- 0856US12475036B2Semiconductor storage deviceKIOXIA CORP·Filed 2024·Granted Nov 18, 2025·0 cites·10 claims
- 0950US11251122B2Semiconductor device having a bonding pad area of a first wiring layer overlaps a bonding pad electrode of a second wiring layerKIOXIA CORP·Filed 2020·Granted Feb 15, 2022·0 cites·16 claims
- 1047US11923324B2Semiconductor memory deviceKIOXIA CORP·Filed 2021·Granted Mar 5, 2024·0 cites·9 claims
- 1147US11302696B2Semiconductor device and method of manufacturing semiconductor deviceKIOXIA CORP·Filed 2020·Granted Apr 12, 2022·0 cites·6 claims
- 1243US9105618B2Semiconductor deviceTOSHIBA KK·Filed 2014·Granted Aug 11, 2015·0 cites·19 claims
- 1341US10269683B2Semiconductor device having a through electrode and method of manufacturing the sameTOSHIBA MEMORY CORP·Filed 2016·Granted Apr 23, 2019·0 cites·7 claims
- 1434US9142307B2Non-volatile semiconductor memory deviceTOSHIBA KK·Filed 2013·Granted Sep 22, 2015·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →