Inventor · disambiguated record
Masakazu Aoyama
Also filed as: AOYAMA MASAKAZU
36 granted patents·3 pending applications·296 citations·filing 2005–2014
97Inventor score
Top patents by PatentIndex Score
39 records- 0196US7834273B2Multilayer printed wiring boardIBIDEN CO LTD·Filed 2006·Granted Nov 16, 2010·41 cites·41 claims
- 0295US8071883B2Flex-rigid wiring board including flexible substrate and non-flexible substrate and method of manufacturing the sameTAKAHASHI MICHIMASA·Filed 2007·Granted Dec 6, 2011·29 cites·24 claims
- 0395US7982135B2Flex-rigid wiring board and method of manufacturing the sameIBIDEN CO LTD·Filed 2007·Granted Jul 19, 2011·28 cites·24 claims
- 0495US7759582B2Multilayer printed wiring boardIBIDEN CO LTD·Filed 2006·Granted Jul 20, 2010·29 cites·31 claims
- 0595US7626829B2Multilayer printed wiring board and manufacturing method of the multilayer printed wiring boardIBIDEN CO LTD·Filed 2005·Granted Dec 1, 2009·36 cites·18 claims
- 0693US8658904B2Flex-rigid wiring board and method for manufacturing the sameNAGANUMA NOBUYUKI·Filed 2010·Granted Feb 25, 2014·18 cites·32 claims
- 0792US8359738B2Method of manufacturing wiring boardIBIDEN CO LTD·Filed 2011·Granted Jan 29, 2013·11 cites·16 claims
- 0892US8035983B2Wiring board and method of manufacturing wiring boardIBIDEN CO LTD·Filed 2008·Granted Oct 11, 2011·18 cites·30 claims
- 0987US8493747B2Flex-rigid wiring board and method for manufacturing the sameNAGANUMA NOBUYUKI·Filed 2010·Granted Jul 23, 2013·8 cites·39 claims
- 1086US8479389B2Method of manufacturing a flex-rigid wiring boardTAKAHASHI MICHIMASA·Filed 2009·Granted Jul 9, 2013·10 cites·20 claims
- 1186US8383948B2Flex-rigid wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2010·Granted Feb 26, 2013·11 cites·18 claims
- 1284US7973249B2Multilayer printed wiring boardIBIDEN CO LTD·Filed 2010·Granted Jul 5, 2011·6 cites·5 claims
- 1382US8353103B2Manufacturing method of multilayer printed wiring boardIBIDEN CO LTD·Filed 2009·Granted Jan 15, 2013·8 cites·4 claims
- 1482US8178789B2Wiring board and method of manufacturing wiring boardTAKAHASHI MICHIMASA·Filed 2008·Granted May 15, 2012·8 cites·34 claims
- 1581US8687380B2Wiring board and method for manufacturing the sameAOYAMA MASAKAZU·Filed 2011·Granted Apr 1, 2014·4 cites·20 claims
- 1680US8481424B2Multilayer printed wiring boardTAKAHASHI MICHIMASA·Filed 2011·Granted Jul 9, 2013·4 cites·20 claims
- 1780US8212363B2Multilayer printed wiring boardTAKAHASHI MICHIMASA·Filed 2010·Granted Jul 3, 2012·4 cites·20 claims
- 1879US8759687B2Flex-rigid wiring board and method for manufacturing the sameNAGANUMA NOBUYUKI·Filed 2010·Granted Jun 24, 2014·4 cites·44 claims
- 1979US8404978B2Flex-rigid wiring board and method for manufacturing the sameNAGANUMA NOBUYUKI·Filed 2010·Granted Mar 26, 2013·4 cites·28 claims
- 2076US9425137B2Wiring boardIBIDEN CO LTD·Filed 2014·Granted Aug 23, 2016·3 cites·16 claims
- 2176US8476531B2Flex-rigid wiring board and method of manufacturing the sameTAKAHASHI MICHIMASA·Filed 2011·Granted Jul 2, 2013·2 cites·10 claims
- 2274US8400782B2Wiring board and method for manufacturing the sameAOYAMA MASAKAZU·Filed 2010·Granted Mar 19, 2013·2 cites·20 claims
- 2373US8933556B2Wiring boardNAGANUMA NOBUYUKI·Filed 2010·Granted Jan 13, 2015·3 cites·17 claims
- 2470US8569630B2Flex-rigid wiring board and method for manufacturing the sameNAGANUMA NOBUYUKI·Filed 2010·Granted Oct 29, 2013·2 cites·21 claims
- 2567US8934262B2Wiring board and method for manufacturing the sameAOYAMA MASAKAZU·Filed 2011·Granted Jan 13, 2015·1 cites·16 claims
- 2665US8461459B2Flex-rigid wiring board and method for manufacturing the sameNAGANUMA NOBUYUKI·Filed 2010·Granted Jun 11, 2013·1 cites·32 claims
- 2762US8040685B2Stacked wiring board and method of manufacturing stacked wiring boardIBIDEN CO LTD·Filed 2008·Granted Oct 18, 2011·1 cites·14 claims
- 2856US8925194B2Flex-rigid wiring board and method of manufacturing the sameTAKAHASHI MICHIMASA·Filed 2011·Granted Jan 6, 2015·0 cites·20 claims
- 2956US8648263B2Wiring board and method of manufacturing wiring boardTAKAHASHI MICHIMASA·Filed 2008·Granted Feb 11, 2014·0 cites·29 claims
- 3056US8525038B2Flex-rigid wiring board and method of manufacturing the sameTAKAHASHI MICHIMASA·Filed 2011·Granted Sep 3, 2013·0 cites·14 claims
- 3155US8669480B2Wiring board and method of manufacturing wiring boardTAKAHASHI MICHIMASA·Filed 2008·Granted Mar 11, 2014·0 cites·28 claims
- 3255US8522429B2Method of manufacturing wiring boardTAKAHASHI MICHIMASA·Filed 2011·Granted Sep 3, 2013·0 cites·13 claims
- 3354US9271405B2Flex-rigid wiring board and method of manufacturing the sameTAKAHASHI MICHIMASA·Filed 2012·Granted Feb 23, 2016·0 cites·20 claims
- 3454US8737087B2Multilayer printed wiring board and manufacturing method of multilayer printed wiring boardIBIDEN CO LTD·Filed 2012·Granted May 27, 2014·0 cites·18 claims
- 3553US8181341B2Method of forming a multilayer printed wiring board having a bulged viaTAKAHASHI MICHIMASA·Filed 2009·Granted May 22, 2012·0 cites·18 claims
- 3653US2011209344A1Wiring board and method of manufacturing wiring boardIBIDEN CO LTD·Filed 2011·Application pending·0 cites
- 3753US2011247212A1Wiring board and method of manufacturing wiring boardIBIDEN CO LTD·Filed 2011·Application pending·0 cites
- 3852US8399775B2Flex-rigid wiring board and method of manufacturing the sameTAKAHASHI MICHIMASA·Filed 2009·Granted Mar 19, 2013·0 cites·20 claims
- 3948US2011252640A1Wiring board and method of manufacturing wiring boardIBIDEN CO LTD·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →