Inventor · disambiguated record
Masao Arima
Also filed as: ARIMA MASAO
21 granted patents·11 pending applications·173 citations·filing 1996–2015
93Inventor score
Top patents by PatentIndex Score
32 records- 0188US9091921B2Layered structure and photosensitive dry film to be used thereforYOSHIDA TAKAHIRO·Filed 2012·Granted Jul 28, 2015·6 cites·4 claims
- 0284US5948514APhotocurable thermosettting resin composition developable with aqueous alkali solutionTAIYO INK MFG CO LTD·Filed 1996·Granted Sep 7, 1999·92 cites·18 claims
- 0379US7825198B2Thermosetting resin composition and multilayer printed wiring board using the sameTAIYO INK MFG CO LTD·Filed 2006·Granted Nov 2, 2010·4 cites·7 claims
- 0477US9188871B2Pattern forming method, alkali-developable thermosetting resin composition, printed circuit board and manufacturing method thereofTAIYO INK MFG CO LTD·Filed 2013·Granted Nov 17, 2015·3 cites·17 claims
- 0575US9068100B2Thermosetting resin composition, cured product thereof, and printed wiring board using the sameTAIYO INK MFG CO LTD·Filed 2012·Granted Jun 30, 2015·2 cites·17 claims
- 0673US9310680B2Photocurable/thermosetting resin compositionITO NOBUHITO·Filed 2012·Granted Apr 12, 2016·2 cites·20 claims
- 0773US7648814B2Black paste composition, method of forming black matrix pattern by using the same, and the black matrix pattern formedTAIYO INK MFG CO LTD·Filed 2008·Granted Jan 19, 2010·3 cites·16 claims
- 0873US7517632B2Silver paste composition, method of forming conductive pattern by using the same, and the conductive pattern formedTAIYO INK MFG CO LTD·Filed 2008·Granted Apr 14, 2009·5 cites·16 claims
- 0970US9497856B2Laminated structure, dry film and method of producing laminated structureTAIYO INK MFG CO LTD·Filed 2013·Granted Nov 15, 2016·1 cites·17 claims
- 1069US9596754B2Dry film, printed wiring board using same, method for producing printed wiring board, and flip chip mounting substrateTAIYO INK MFG CO LTD·Filed 2012·Granted Mar 14, 2017·4 cites·20 claims
- 1168US8765831B2Photocurable resin compositionMINEGISHI SHOJI·Filed 2010·Granted Jul 1, 2014·2 cites·20 claims
- 1267US5741622AOne-package photosolder resist composition developable with aqueous alkali solution and method for production of printed circuit board by use thereofTAIYO INK MFG CO LTD·Filed 1996·Granted Apr 21, 1998·29 cites·40 claims
- 1361US8101336B2Photocurable and thermosetting resin composition, cured product thereof, and printed circuit boardITOH NOBUHITO·Filed 2008·Granted Jan 24, 2012·2 cites·13 claims
- 1457US8048613B2Alkali development-type solder resist, cured product thereof, and printed wiring board prepared by using the sameTAIYO INK MFG CO LTD·Filed 2008·Granted Nov 1, 2011·6 cites·24 claims
- 1551US2009035591A1Flexible laminate having thermoplastic polyimide layer and method for manufacturing the sameKURASHIKI BOSEKI KK·Filed 2008·Application pending·0 cites
- 1649US9423691B2Layered structure and photosensitive dry film to be used thereforTAIYO HOLDINGS CO LTD·Filed 2015·Granted Aug 23, 2016·0 cites·13 claims
- 1749US2013085208A1Photosensitive resin composition, cured film thereof and printed circuit boardTAIYO INK MFG CO LTD·Filed 2012·Application pending·0 cites
- 1846US6177490B1Liquid thermosetting filling composition and method for permanently filling holes in printed circuit board by the use thereofTAIYO INK MFG CO LTD·Filed 1998·Granted Jan 23, 2001·12 cites·8 claims
- 1944US7838197B2Photosensitive compositionTAIYO INK MFG CO LTD·Filed 2007·Granted Nov 23, 2010·0 cites·9 claims
- 2044US2012301825A1Layered structure and photosensitive dry film to be used thereforYOSHIDA TAKAHIRO·Filed 2012·Application pending·0 cites
- 2143US8962712B2Photosensitive resin composition, dry film thereof, and printed wiring board using themITO NOBUHITO·Filed 2012·Granted Feb 24, 2015·0 cites·18 claims
- 2243US2009029181A1Photocurable and thermosetting resin composition, cured product thereof, and printed wiring board obtained by using the sameSHIBASAKI YOKO·Filed 2008·Application pending·0 cites
- 2342US8722816B2Solder resist, dry film thereof, cured product, and printed wiring boardOTSUKI NOBUAKI·Filed 2008·Granted May 13, 2014·0 cites·10 claims
- 2442US2008096133A1Photocurable and thermosetting resin composition, cured product thereof and printed circuit board obtained using the sameKATO KENJI·Filed 2007·Application pending·0 cites
- 2542US2013081864A1Photosensitive resin composition, cured film thereof and printed circuit boardTAIYO INK MFG CO LTD·Filed 2012·Application pending·0 cites
- 2641US8642234B2Photosensitive resin, curable resin composition containing the same, dry film thereof, and printed circuit board using themITO NOBUHITO·Filed 2011·Granted Feb 4, 2014·0 cites·7 claims
- 2741US2009194319A1Photocurable resin composition, dry film, cured product, and printed circuit boardITOH NOBUHITO·Filed 2009·Application pending·0 cites
- 2840US2013081858A1Photosensitive resin composition, cured film thereof and printed circuit boardTAIYO INK MFG CO LTD·Filed 2012·Application pending·0 cites
- 2937US2012168215A1Curable resin compositionSHIINA TOUKO·Filed 2010·Application pending·0 cites
- 3033US2012308838A1Photocurable resin composition, dry film, cured article and printed wiring boardITO NOBUHITO·Filed 2011·Application pending·0 cites
- 3130US2015014029A1Photosensitive composition, hardened coating films therefrom, and printed wiring boards using sameIWAYAMA HIROSHI·Filed 2012·Application pending·0 cites
- 3228US8748502B2Photocurable resin compositionSHIBASAKI YOKO·Filed 2010·Granted Jun 10, 2014·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →