Inventor · disambiguated record
Marco Arnold
Also filed as: ARNOLD MARCO
20 granted patents·9 pending applications·14 citations·filing 2008–2023
89Inventor score
Files withBASF SE22ROEGER-GOEPFERT CORNELIA3DeepUp GmbH1EOS GMBH ELECTRO OPTICAL SYSTEMS1SIEMER MICHAEL1
Top patents by PatentIndex Score
29 records- 0189US9758885B2Composition for metal electroplating comprising leveling agentBASF SE·Filed 2013·Granted Sep 12, 2017·6 cites·16 claims
- 0281US12054842B2Composition for tin-silver alloy electroplating comprising a complexing agentBASF SE·Filed 2019·Granted Aug 6, 2024·1 cites·19 claims
- 0375US9631292B2Composition for metal electroplating comprising an additive for bottom-up filling of though silicon vias and interconnect featuresROEGER-GOEPFERT CORNELIA·Filed 2012·Granted Apr 25, 2017·4 cites·20 claims
- 0472US11486049B2Composition for metal electroplating comprising leveling agentBASF SE·Filed 2019·Granted Nov 1, 2022·0 cites·16 claims
- 0571US2022298664A1Composition for Cobalt Electroplating Comprising Leveling AgentBASF SE·Filed 2022·Application pending·0 cites
- 0666US11926918B2Composition for metal plating comprising suppressing agent for void free filingBASF SE·Filed 2017·Granted Mar 12, 2024·1 cites·17 claims
- 0766US11377748B2Composition for cobalt electroplating comprising leveling agentBASF SE·Filed 2018·Granted Jul 5, 2022·0 cites·12 claims
- 0866US8257798B2Method for the creation of extensive variations in size or distance in nanostructure patterns on surfacesSPATZ JOACHIM P·Filed 2008·Granted Sep 4, 2012·2 cites·21 claims
- 0963US11840771B2Composition for tin or tin alloy electroplating comprising suppressing agentBASF SE·Filed 2021·Granted Dec 12, 2023·0 cites·15 claims
- 1061US2025388725A1Use of a composition comprising a polyaminoamide type compound for copper nanotwin electrodepositionBASF SE·Filed 2023·Application pending·0 cites
- 1160US12428520B2Epoxy resin compositionBASF SE·Filed 2021·Granted Sep 30, 2025·0 cites·10 claims
- 1258US2021040635A1Composition for cobalt plating comprising additive for void-free submicron feature fillingBASF SE·Filed 2020·Application pending·0 cites
- 1356US9834677B2Composition for metal electroplating comprising leveling agentROEGER-GOEPFERT CORNELIA·Filed 2011·Granted Dec 5, 2017·0 cites·28 claims
- 1455US11535946B2Composition for tin or tin alloy electroplating comprising leveling agentBASF SE·Filed 2018·Granted Dec 27, 2022·0 cites·14 claims
- 1553US11459665B2Composition for tin or tin alloy electroplating comprising suppressing agentBASF SE·Filed 2018·Granted Oct 4, 2022·0 cites·19 claims
- 1653US11242606B2Composition for tin or tin alloy electroplating comprising suppressing agentBASF SE·Filed 2019·Granted Feb 8, 2022·0 cites·14 claims
- 1752US2025011961A1Composition for tin or tin alloy electroplating comprising a pyrazole-type antioxidantBASF SE·Filed 2022·Application pending·0 cites
- 1852US2025001502A1Detection of the oxidation progress of metal condensateEOS GMBH ELECTRO OPTICAL SYSTEMS·Filed 2022·Application pending·0 cites
- 1950US12509790B2Composition for tin or tin alloy electroplating comprising leveling agentBASF SE·Filed 2021·Granted Dec 30, 2025·0 cites·19 claims
- 2050US12098473B2Composition for cobalt plating comprising additive for void-free submicron feature fillingBASF SE·Filed 2019·Granted Sep 24, 2024·0 cites·19 claims
- 2149US2022356592A1Composition for copper bump electrodeposition comprising a leveling agentBASF SE·Filed 2020·Application pending·0 cites
- 2249US2022282967A1Method and mobile detection unit for detecting elements of infrastructure of an underground line networkDeepUp GmbH·Filed 2020·Application pending·0 cites
- 2348US9683302B2Composition for metal electroplating comprising leveling agentSIEMER MICHAEL·Filed 2011·Granted Jun 20, 2017·0 cites·19 claims
- 2448US2019226107A1Composition for cobalt plating comprising additive for void-free submicron feature fillingBASF SE·Filed 2017·Application pending·0 cites
- 2546US2025129503A1Composition for copper electrodeposition comprising a polyaminoamide type leveling agentBASF SE·Filed 2022·Application pending·0 cites
- 2645US12134834B2Composition for copper bump electrodeposition comprising a polyaminoamide type leveling agentBASF SE·Filed 2021·Granted Nov 5, 2024·0 cites·20 claims
- 2739US11387108B2Composition for metal electroplating comprising leveling agentBASF SE·Filed 2018·Granted Jul 12, 2022·0 cites·17 claims
- 2837US9598540B2Composition for metal electroplating comprising leveling agentROEGER-GOEPFERT CORNELIA·Filed 2010·Granted Mar 21, 2017·0 cites·21 claims
- 2936US11585004B2Composition for cobalt or cobalt alloy electroplatingBASF SE·Filed 2019·Granted Feb 21, 2023·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →