Inventor · disambiguated record
Ma. Shirley Asoy
Also filed as: ASOY MA SHIRLEY
5 granted patents·54 citations·filing 2006–2010
80Inventor score
Top patents by PatentIndex Score
5 records- 0194US7535086B2Integrated circuit package-on-package stacking systemSTATS CHIPPAC LTD·Filed 2006·Granted May 19, 2009·34 cites·8 claims
- 0276US7718472B2Integrated circuit package-on-package stacking system and method of manufacture thereofSTATS CHIPPAC LTD·Filed 2009·Granted May 18, 2010·5 cites·10 claims
- 0375US7868434B2Integrated circuit package-on-package stacking systemSTATS CHIPPAC LTD·Filed 2010·Granted Jan 11, 2011·3 cites·10 claims
- 0472US8293584B2Integrated circuit package system with filled wafer recessGUILLERMO DENNIS·Filed 2006·Granted Oct 23, 2012·6 cites·20 claims
- 0572US7829384B2Semiconductor device and method of laser-marking wafers with tape applied to its active surfaceSTATS CHIPPAC LTD·Filed 2008·Granted Nov 9, 2010·6 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →