Inventor · disambiguated record
Marco Bäßler
Also filed as: BÄSSLER MARCO
2 granted patents·4 pending applications·0 citations·filing 2023–2024
26Inventor score
Technology areasH10W
Files withINFINEON TECHNOLOGIES AG6
Top patents by PatentIndex Score
6 records- 0176US2025062290A1Power semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 0272US12211824B2Power semiconductor package having first and second lead framesINFINEON TECHNOLOGIES AG·Filed 2023·Granted Jan 28, 2025·0 cites·15 claims
- 0353US2024332136A1Power semiconductor device with a stress-free joint between metal parts and method for fabricating the sameINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 0453US2025246490A1Electronic Component With Reduced InductanceINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 0549US12463148B2Power semiconductor module with vibration dampeners and power electronics system including the power semiconductor moduleINFINEON TECHNOLOGIES AG·Filed 2023·Granted Nov 4, 2025·0 cites·17 claims
- 0647US2024404925A1Molded power semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →